1-1963557-5 Allicdata Electronics
Allicdata Part #:

1-1963557-5-ND

Manufacturer Part#:

1-1963557-5

Price: $ 7.88
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 5 FINS,1.375 OD HS W/4 LEGS,3
More Detail: Heat Sink
DataSheet: 1-1963557-5 datasheet1-1963557-5 Datasheet/PDF
Quantity: 1000
250 +: $ 7.08435
Stock 1000Can Ship Immediately
$ 7.88
Specifications
Series: *
Part Status: Active
Description

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1-1963557-5 Application Field and Working Principle

Thermal-heat sinks are used in the development of many types of electronic devices. These devices require a stable thermal environment in order to maintain optimum performance. Thermal-heat sinks provide a reliable and necessary cooling solution for many types of electronics.

Thermal-heat sinks are modeled on a convection process, which means that heat is transferred from one object to another through a medium. In the case of thermal-heat sinks, this medium is usually air. Heat is generated within the enclosed environment of an electronic device and is dissipated through the design of the heat sink.

The basic principle of thermal-heat sinks is that heat is more efficiently conducted away from a heat-producing area if it is placed in physical contact with a conducting material that can extract the heat at a fast rate. Thus thermal-heat sinks are designed to allow heat to move from the device to the outside air environment.

Thermal-heat sinks are most commonly composed of an aluminum alloy, copper or some combination of the two materials. The material that makes up the heat sink is usually chosen for its ability to efficiently remove heat, meaning it can take the heat away from the electronic component quickly and effectively. Typically, a copper or aluminum alloy is used because of its high thermal conductivity, which is what enables the heat to be quickly moved away from the device.

The design of a thermal-heat sink depends on the size and shape of the electronic device, its operating temperature and power levels. A few common design principles include fin design, which means the orientation of the fins, bracket design which helps support the heat sink on its operating surface, and coolant design, which helps in facilitating the movement of heat between the components and the environment.

A popular type of thermal-heat sink is the passive heat sink, which allows air to move through the fins of the device. The air is drawn in by convection from the bottom of the heat sink and is then expelled from the top. This allows for more efficient cooling as the air has a higher temperature to move away from faster.

Active thermal-heat sinks are typically used in high-power electronics where air-cooling and natural convection alone are not enough to keep the components at a reliable and safe temperature. Active thermal-heat sinks use a blower fan to help move the air, and therefore heat, away from the demanding electronic components.

Thermal-heat sinks are an essential component of many electronic devices and have been designed in such a way that they protect components from overheating. Today, they are one of the most common pieces of hardware in the electronics industry and are used in a variety of different applications, from consumer electronics to industrial settings.

The specific data is subject to PDF, and the above content is for reference

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