1-1963562-3 Allicdata Electronics
Allicdata Part #:

1-1963562-3-ND

Manufacturer Part#:

1-1963562-3

Price: $ 8.86
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 3 FINS,1.375 OD HS W/4 LEGS,42.5
More Detail: Heat Sink
DataSheet: 1-1963562-3 datasheet1-1963562-3 Datasheet/PDF
Quantity: 1000
250 +: $ 7.96852
Stock 1000Can Ship Immediately
$ 8.86
Specifications
Series: *
Part Status: Active
Description

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Thermal – Heat Sinks are necessary components for many applications nowadays due to their high thermal performance and the ability to cool critical components. However, thermal-heat sinks are complex structures that require a careful design to ensure efficient cooling. The 1-1963562-3 application field and working principle is a comprehensive guide to the efficient design of fin-and-heat-sink assemblies.

The typical thermal-heat sink design involves a combination of thin fin and heat dissipating base plate. This configuration allows for efficient heat transfer, as the fins\' thin profiles provide a large surface area for exposure to cold air, allowing for greater convective heat loss and faster dissipation. The base plate is generally made from a metal material and is used to provide structural support for the fins. In addition, the base plate also helps to draw heat away from the fins, which are typically made from a material such as aluminum or graphite.

The 1-1963562-3 working principle explains how fin-and-heat-sink assemblies work. In a fin-and-heat-sink assembly, a fin is placed between a heat source and a heat sink. The fin allows for more efficient heat transfer, as it allows heat to be conducted from the source to the sink more quickly. This faster transfer rate means that the heat source is able to deliver more heat to the heat sink, leading to faster dissipation of heat.

The 1-1963562-3 application field explains how these assemblies can be used in different applications. One example is in computing systems, where a fin-and-heat-sink assembly is used to dissipate the large amounts of heat generated from processors and other computing components. This allows for increased system performance, as the higher performance heat sinks lead to much lower temperatures inside the computer case, allowing for more efficient operation.

Other applications of fin-and-heat-sink assemblies include air conditioning systems, refrigeration systems, automotive cooling systems, and industrial manufacturing processes. In these applications, the fin-and-heat-sink assemblies help to reduce the temperature of the systems, allowing them to run more efficiently and providing a higher level of reliability. By understanding the 1-1963562-3 principle, engineers can design systems that use these assemblies safely and effectively.

The 1-1963562-3 application field and working principle are essential for efficient and reliable thermal-heat-sink assembly designs. By understanding the working principle as well as the different application fields where these components can be used, engineers can ensure that their designs provide the highest level of performance and reliability for customers.

The specific data is subject to PDF, and the above content is for reference

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