Allicdata Part #: | 1-211992-2-ND |
Manufacturer Part#: |
1-211992-2 |
Price: | $ 180.10 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | RECEPT ASSY,SZ 3,ARINC 600 |
More Detail: | Receptacle Connector Arinc 150/150/100/150/150/10... |
DataSheet: | 1-211992-2 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
50 +: | $ 163.72600 |
Series: | 600 |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Shell Style: | Receptacle |
Class: | Non-Environmental |
Class Code: | A |
Shell Size: | 3 |
Cavity A: | 150 |
Cavity B: | 150 |
Cavity C: | 100 |
Cavity D: | 150 |
Cavity E: | 150 |
Cavity F: | 100 |
Sealed: | Un-Sealed |
Shell Plating: | Chromate |
Termination: | -- |
Features: | Cinch Nuts (6-32), Front Release |
Note: | Contacts Not Included |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ARINC Backplane Connectors are specialized interconnect devices designed for a wide variety of applications. They are capable of transmitting digital information, such as serial and parallel data, at high speeds. In addition, they are popular in the aerospace industry as they are designed to meet the high-reliability requirements of the industry.
The ARINC backplane connector is designed to attach to a printed circuit board (PCB) and provide electrical contact between two or more components. The contact is made with the pins on the connector. The contact between the pins is maintained by a spring-loaded mechanism that pushes the pins against the PCB. This provides a reliable connection that holds even when there is vibration or shock.
The ARINC backplane connector is a high-density interconnection device. It is designed to reduce the number of components required to build a system. This helps to reduce cost and complexity, as well as save space. It can also be used for multi-channel systems, which allow multiple components to share the same channel.
The ARINC backplane connector is capable of working in both high-speed and low-speed applications. It is designed to handle a wide range of voltages, temperatures, and frequencies. It can also be used in active mode, which requires high-voltage logic solutions. In addition, it can be used for LVDS (Low Voltage Differential Signaling) applications.
The ARINC backplane connector is also capable of handling a variety of signal types, including data, power, and clock signals. It offers a variety of termination types to accommodate different system requirements. In addition, the connector can be used in either a unidirectional or bidirectional configuration.
The ARINC backplane connector is designed to offer reliable interconnection in harsh environmental conditions. It is designed to handle extreme temperatures, humidity, vibration, shock, and high levels of EMI (electromagnetic interference). This makes it ideal for applications in the aerospace industry, where reliable and robust communication is essential.
The working principle of the ARINC backplane connector is simple. Two or more connectors are placed on the same board, usually on opposite sides. Each connector is then connected to the other through conductive pads that are created by an etch pattern. The boards are connected in a daisy-chain configuration, allowing for multiple connections.
In addition, the connector is designed to be compatible with a variety of ICs (integrated circuits). This means that it can be used to connect different chips together or as part of an embedded system. This allows designers to create more complex systems with less components.
ARINC backplane connectors are a highly versatile interconnection solution. They are suitable for a wide variety of applications, from high-speed to low-speed systems and from aerospace to automotive applications. They offer reliable and robust communication in a variety of environments and are designed to meet the needs of today’s complex designs.
The specific data is subject to PDF, and the above content is for reference
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