10081531-11208LF

Series:	10081531
Packaging:	Tray
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Connector Style:	RDIMM
Number of Positions:	240
Memory Type:	DDR3 SDRAM
Standards:	MO-269
Mounting Type:	Through Hole
Features:	Board Guide, Latches
Mounting Feature:	Normal, Standard - Top
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)

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Introduction

Memory connectors, and in particular the 10081531-11208LF inline module socket, are versatile and valuable connections within computing and data storage devices. Due to their combination of performance, efficiency, and reliability, they have been used commercially and in industrial contexts for a long time. This article will explore the application fields and working principles of the 10081531-11208LF inline module socket, delving into each of its components and capabilities.

Application Fields

The design of the 10081531-11208LF inline module socket renders it capable of providing a reliable connection for a wide range of applications. Commonly, these sockets are used within motherboards and other chipsets, often connecting integrated memory modules and RAM modules. Typical applications that make use of 10081531-11208LF inline module sockets can include the integrated circuit boards of computers, laptops, and servers, as well as storage media such as flash drives.These sockets have also been used in industrial settings, where temperatures and levels of vibration beyond the normal household range may be encountered. Here, 10081531-11208LF module sockets have proven particularly capable, providing high levels of performance and reliable contact throughout the duration of use.

Working Principle

The 10081531-11208LF inline module socket is designed to provide connection without compromising performance or accuracy. This is achieved through the use of several components, each of which plays a part in creating the secure, reliable connection. The socket comprises of several parts, including a contact, an insulator, and a latch band. The contact is the joint between two components that makes a connection, providing the medium through which the components communicate. It is also protected by an insulator, which is non-conductive, so preventing any interference with the low-voltage parts. Finally, the latch band is a robust metal strip that does not permit the socket to be disengaged, thus preventing the connection from being accidentally disconnected. The interface of the 10081531-11208LF module socket is also fit with integral IC shield technology. This feature guards against electromagnetic interference from the environment, ensuring that a secure, shielded line of communication is established between two components. Overall, the combination of the three components and the IC shield technology enable the 10081531-11208LF module socket to establish a reliable, secure connection between two components, no matter what the environment.

Conclusion

The 10081531-11208LF inline module socket has proven a versatile and reliable connection in different application fields. By making use of the contact, insulator, latch band and IC shield technology, it is able to provide secure, shielded connections between two components in a wide range of temperatures and levels of vibration. This has made it invaluable for use within computers, laptops, servers and other industrial settings, where high levels of performance and reliability are essential for the system to operate successfully.

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