10087607-10033LF Allicdata Electronics
Allicdata Part #:

10087607-10033LF-ND

Manufacturer Part#:

10087607-10033LF

Price: $ 3.23
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SKT DIMM 240POS PCB
More Detail: 240 Position DIMM DDR3 SDRAM Socket Through Hole
DataSheet: 10087607-10033LF datasheet10087607-10033LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1680 +: $ 2.93471
Stock 1000Can Ship Immediately
$ 3.23
Specifications
Contact Finish Thickness: 30.0µin (0.76µm)
Series: 10087607
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Style: DIMM
Number of Positions: 240
Memory Type: DDR3 SDRAM
Standards: MO-269
Mounting Type: Through Hole
Features: Board Lock, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory Connectors - Inline Module Sockets provide data and connection points for computers, phones and other devices to access memory modules. The 10087607-10033LF is a particularly useful socket for managing memory modules, providing the user with increased performance, reliability and ease of use. In this article, we will explore the application field and working principle of the 10087607-10033LF injection module socket.

The 10087607-10033LF is designed to interface with memory devices such as DDR3 and DDR4 SDRAM. It has a wide range of applications in multiple industries, from consumer electronics to industrial automation. It is mainly used as a means of adding extra storage capacity and flexibility to existing systems, allowing the user to manage their memory usage more efficiently. This socket is also an integral part of many other applications, such as data visualization and scientific computing.

The 10087607-10033LF injection module socket is based on a four-layer board design, consisting of a core layer, insulating layer, signal layer and contact layer. The insulating layer consists of two pieces: an inner insulating layer and an outer insulating layer. The outer insulating layer is designed to protect and support the contact layer, while the inner insulating layer provides superior electrical insulation between the layers. The signal layer consists of signal protection strips which act as secondary insulation. This layer also provides support for the contact layer, as well as providing electrical separation between the signal lines and the ground of the core layer.

The 10087607-10033LF socket contact layer consists of an array of pins connected to the signal and power lines of the socket. This layer is responsible for making electrical contact with the memory module when it is inserted into the socket. The contact layer is designed to achieve reliable electrical contact, while minimizing the risk of contact shorts.

The 10087607-10033LF socket is designed to be easy to use. It features an intuitive design which allows the user to effortlessly insert and remove the memory module. The socket is also designed to reduce the risk of improper insertion, helping to ensure the module is securely placed in the socket and increasing its lifespan.

The 10087607-10033LF socket is designed to improve system performance by providing faster data transfer rates and lower power consumption. It is also designed to be reliable, with a low failure rate and minimal variations in performance. The module is EMI compliant, meaning it is able to reduce the risk of interference with other electronic components.

In conclusion, the 10087607-10033LF injection module socket is a reliable and easy to use socket designed to improve system performance and reduce the risk of electrical interference in various applications. It features an intuitive design which allows for quick and easy installation and removal of memory modules. The socket is also designed to increase the lifespan of memory modules, making it a great choice for both consumer and industrial applications.

The specific data is subject to PDF, and the above content is for reference

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