Allicdata Part #: | 609-5458-2-ND |
Manufacturer Part#: |
10144518-102802LF |
Price: | $ 0.88 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | CONN PLUG 5.7MM SMD 100POS |
More Detail: | 100 Position Connector Plug, Center Strip Contacts... |
DataSheet: | 10144518-102802LF Datasheet/PDF |
Quantity: | 2200 |
550 +: | $ 0.78641 |
1100 +: | $ 0.67407 |
1650 +: | $ 0.65160 |
2750 +: | $ 0.62913 |
5500 +: | $ 0.59768 |
Series: | Bergstak® |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Connector Type: | Plug, Center Strip Contacts |
Number of Positions: | 100 |
Pitch: | 0.031" (0.80mm) |
Number of Rows: | 2 |
Mounting Type: | Surface Mount |
Features: | Board Guide, Pick and Place |
Contact Finish: | Gold |
Contact Finish Thickness: | 8.00µin (0.203µm) |
Mated Stacking Heights: | 6mm, 10mm, 14mm |
Height Above Board: | 0.224" (5.70mm) |
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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) are an important subset of connectors used to transmit power and signals between two components. 10144518-102802LF is a highly efficient variant of these connectors. It enables high speed signal transmission in a wide range of wavelengths and in a short time. This connector combines flexibility with performance to meet the demands of a variety of applications.
The 10144518-102802LF features a solderable or removable post configuration with extremely low contact resistance. This configuration offers superior signal integrity and stability for signals with low signal integrity and noise immunity. The posts are recessed to allow for higher load capacity and current-carrying capacity, allowing for increased frequency and power handling capabilities. The contacts are made of copper alloy to ensure optimal conductivity and durability over a wide range of temperatures. The contact pressure is optimized with a three-point contact system designed to eliminate any risk of intermittent connections. The connectors also feature a robust built-in strain relief system to prevent the connector from becoming loose under pressure.
The 10144518-102802LF connector is primarily used for connecting boards, components, and terminations in signal applications such as telecoms, networking, computers, and other consumer and industrial applications. Its integration of superior electrical characteristics and integrated strain relief offers excellent performance in signal integrity, RF immunity, and transfer rate on a consistent basis. This is especially important in high-speed, high-density applications due to the increasing popularity of Optical Fiber and Wireless technologies.
The 10144518-102802LF\'s working principles are based on principles of electrical energy transmission. When the contact form is pressed, an electrical current is generated that gets transferred to the contacts, where electrical energy is generated and passed on to the load. This transfer of electrical energy is known as Skin Effect, and it is a result of the separated electrical signals passing through a conductor such as a wire. This current transfer is linked to the principle of induction, meaning the voltage generated by the contact form will induce a current in the contacts.
To ensure high signal integrity and reliable connectivity, the contacts between the 10144518-102802LF and the device have to be carefully designed. A high quality, low impedance contact needs to be created to allow the energy to transfer efficiently between both items without degradation. The design also needs to be optimized for maximum thermal conductivity so that the contacts maintain optimum temperatures for reliable operation. The surface of the contacts must also be carefully tuned to minimize electrical disparity.
The 10144518-102802LF is a highly efficient and versatile rectangular connector that can be used in a variety of applications. Its superior electrical characteristics and integrated strain relief system offer excellent performance in signal integrity, RF immunity, and transfer rate which makes it an ideal choice for high-speed, high-density applications, such as telecoms, networking, computers, and other consumer and industrial applications.
The specific data is subject to PDF, and the above content is for reference
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