10AS022E3F27E1HG Allicdata Electronics
Allicdata Part #:

10AS022E3F27E1HG-ND

Manufacturer Part#:

10AS022E3F27E1HG

Price: $ 598.75
Product Category:

Integrated Circuits (ICs)

Manufacturer: Intel FPGAs/Altera
Short Description: IC SOC FPGA 240 I/O 672FBGA
More Detail: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Syste...
DataSheet: 10AS022E3F27E1HG datasheet10AS022E3F27E1HG Datasheet/PDF
Quantity: 1000
3 +: $ 544.32000
Stock 1000Can Ship Immediately
$ 598.75
Specifications
Series: Arria 10 SX
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 220K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)
Number of I/O: 240
Description

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The 10AS022E3F27E1HG technology is a type of embedded system on chip (SoC) that integrates a range of functions such as processor, memory, input/output (I/O), and power management into a single integrated circuit package. This type of embedded system is designed to provide the basic building blocks for designing an entire embedded device with a much reduced physical size and power consumption compared to conventional electrical and mechanical systems.

The main component of the 10AS022E3F27E1HG SoC is the processor, which serves as the brains of the system. The processor is responsible for controlling the operation of the device, performing calculations as well as providing access to memory and I/O pins. The memory component of the SoC provides storage for variables, data, and program code while the I/O pins allow the system to communicate with external components such as displays, sensors and other devices.

In addition to the processor, memory and I/O components, the 10AS022E3F27E1HG SoC also includes power management, analog and digital functionality, networking, and other features. All of these components are integrated into a single package, thus providing an efficient solution for designers who need to squeeze multiple features into a constrained design space. The use of this type of SoC also reduces power consumption by consolidating all of the necessary components, thus reducing the number of power-hungry components required for a given system.

The 10AS022E3F27E1HG SoC can be used to solve a variety of embedded system challenges, including those related to industrial automation, automotive, consumer electronics, medical and military applications. By using this technology, designers can achieve greater system integration, reduced power consumption, and improved cost savings. Its main application is in the embedded system field and the working principle is that it enables the development of embedded systems with a much smaller and more energy efficient footprint.

The 10AS022E3F27E1HG SoC is a very efficient solution for embedded system designers who are looking to develop more sophisticated and reliable systems in a smaller form factor. With its integrated components, low power consumption, and efficient package, this technology provides a great alternative for creating and deploying embedded systems with greatly reduced costs and power requirement requirements.

The specific data is subject to PDF, and the above content is for reference

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