10AS027E2F27E2SG

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System on chip (SoC) integrated circuits are semiconductor packages that are designed to encapsulate multiple layers of logic, memory, and circuits for an electronics system into a single package. The 10AS027E2F27E2SG is an example of such a chip, used for various embedded applications where power density and space are major concerns. The 10AS027E2F27E2SG integrates embedded physical systems, ASICs, embedded memories, and analog/mixed signal systems into a single package for improved performance and scalability.

The 10AS027E2F27E2SG is designed to meet the needs of various embedded applications. It integrates an embedded physical system, comprising ARM Cortex-A/R processors, on-chip L2 cache, and multi-core configurable Interconnect Hub (IH). This includes four levels of cache and a Deep Packet Address Router (DPAR) to aid in the optimization of memory and packet fragmentation on the device. The 10AS027E2F27E2SG also includes an analog/mixed signal system, comprising a low-leakage High-Voltage Digital System (HVDS) and configurable software, to support a variety of analog and control I/O and power management requirements.

The 10AS027E2F27E2SG also integrates embedded memory and ASICs. The embedded memory consists of configurable banks of double-data rate (DDR) memory, distributed RAMs, and programmable Interconnect RMUs for improved space utilization. The ASICs, which include a secure boot controller, secure non-volatile memory controller, and several power management/clock resources and digital logic, are fullly integrated into the chip to reduce the number of external components. The clock resources, which include oscillators, phase-locked loops (PLLs), and DDR & LVDS buffers, are designed to optimize clock and phase timing for various applications.

The 10AS027E2F27E2SG is designed to provide the ultimate in scalability, able to satisfy the requirements of a variety of embedded applications. The device is designed for operation over wide ranges of temperatures, with operating temperature range from -50°C to +110°C. It is also designed to support high data throughput, with peak data transfer rates up to 200 Mbps. Finally, the device can provide lower power consumption, even when compared with conventional FPGA designs, which can result in improved system performance.

The 10AS027E2F27E2SG is an ideal solution for various embedded applications where power density and space, as well as performance, are major concerns. It is an all-in-one design, integrating a physical system, digital logic, memory structures, and analog/mixed signal systems into a single package. This provides superior scalability, power efficiency, and performance, while reducing the number of external components required in the system. The device is specifically designed to operate in extreme environments, with temperature ratings extending from -50°C to +110°C and peak data transfer rates up to 200 Mbps. The 10AS027E2F27E2SG is an ideal option for various embedded applications requiring increased performance and scalability in a compact package.

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