Allicdata Part #: | 10AS032E1F27E1SG-ND |
Manufacturer Part#: |
10AS032E1F27E1SG |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Intel FPGAs/Altera |
Short Description: | IC SOC FPGA 240 I/O 672FBGA |
More Detail: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Syste... |
DataSheet: | 10AS032E1F27E1SG Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | Arria 10 SX |
Packaging: | Tray |
Part Status: | Discontinued at Digi-Key |
Architecture: | MCU, FPGA |
Core Processor: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: | -- |
RAM Size: | 256KB |
Peripherals: | DMA, POR, WDT |
Connectivity: | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: | 1.5GHz |
Primary Attributes: | FPGA - 320K Logic Elements |
Operating Temperature: | 0°C ~ 100°C (TJ) |
Package / Case: | 672-BBGA, FCBGA |
Supplier Device Package: | 672-FBGA (27x27) |
Number of I/O: | 240 |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
。Embedded Systems On Chip (ESOCs) are integrated devices that combine digital signal and logic functions on one single semiconductor chip. ESOCs typically include multiple processors such as a central processing unit and a microcontroller, along with memory, signal processing, and other peripheral modules. ESOCs are designed to reduce the cost and complexity of design, while maintaining performance and power efficiency.
The 10AS032E1F27E1SG application field covers a broad range of industries including automotive, industrial, and medical applications. This ESOC is designed to work in conditions with wide temperature ranges and offers a high degree of flexibility and robustness. It provides a number of connectivity options such as CAN, MOST, USB, and Ethernet and is ideal for applications that require high levels of communication, control, and networking.
The 10AS032E1F27E1SG works on the principle of distributed processing, which involves coordination among multiple processing cores. Each core is responsible for a specific task and works independently from the others. This improves the speed and accuracy of the processing, as well as reducing the power consumption of the device. In addition, it can accommodate multiple operating systems, allowing for easy development and debugging.
The 10AS032E1F27E1SG has a large number of application-specific instructions (ASI) that allow the device to manage various tasks such as controlling peripherals, implementing algorithms, and completing data transfer. The ASIs are customisable and can be changed based on the application’s requirements.The 10AS032E1F27E1SG also supports advanced security functions designed to protect the data it contains from external threats.
The 10AS032E1F27E1SG has a number of features that make it an ideal choice for embedded applications. It is a highly configurable and versatile ESOC with a low power consumption. It offers high throughput performance, multiple connectivity options, and advanced security protocols. In addition, it is designed to support hardware and software co-design to create custom hardware platforms based on the specific needs of the application.
The 10AS032E1F27E1SG offers great flexibility and performance, making it an ideal choice for embedded systems. It is easy to configure and use and has a number of useful features that make it suitable for a wide range of applications. The device is designed to be low power, cost effective, and highly reliable and is a great choice for those looking for a reliable ESOC solution.
The specific data is subject to PDF, and the above content is for reference
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