1130BG Allicdata Electronics
Allicdata Part #:

1130BG-ND

Manufacturer Part#:

1130BG

Price: $ 7.11
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK
More Detail: Heat Sink TO-5 Aluminum Board Level
DataSheet: 1130BG datasheet1130BG Datasheet/PDF
Quantity: 1000
250 +: $ 6.39885
Stock 1000Can Ship Immediately
$ 7.11
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Shape: Cylindrical
Length: 0.400" (10.16mm)
Width: 0.315" (8.00mm) ID
Diameter: 0.450" (11.43mm)
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 15°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 1130BG is a thermal-heat sink that is tailored towards specific applications. It is designed to support a series of hardware components that require effective cooling to prevent overheating. This thermal-heat sink is mainly used in applications such as industrial processes, medical equipment, computer cooling, and more.

The 1130BG has an integral cooling fan, which helps to dissipate the heat produced by the hardware components that it supports. It provides an excellent thermal management solution and guarantees reliable operation for years. This thermal-heat sink also features a copper-grade base and contains several plates, whic help to draw and diffuse heat energy more effectively. It is also available in a variety of shapes to suit the various applications that it can be used for.

The working principle of the 1130BG thermal-heat sink is based on the fact that when heat is generated from the hardware components, the fan draws air in and blows them out. This helps to dissipate the heat from the hardware components that it supports, thus allowing for safe and efficient operation. Also, the copper-grade base absorbs heat from the components and transfers it to the plates, which further disperse the heat. This thermal-heat sink also helps to maintain a constant temperature and minimize the chances of the components overheating.

The 1130BG thermal-heat sink is designed to be reliable and efficient, and can support a wide range of hardware components. It is also designed to be cost effective, and its easy to install and maintain. Furthermore, it is designed to be robust, which helps to increase its longevity. All in all, the 1130BG thermal-heat sink is an excellent choice for applications that require effective cooling and thermal management.

The specific data is subject to PDF, and the above content is for reference

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