Allicdata Part #: | 1597-1046-ND |
Manufacturer Part#: |
114990125 |
Price: | $ 0.70 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Seeed Technology Co., Ltd |
Short Description: | HEAT SINK KIT FOR RASPBERRY PI |
More Detail: | Heat Sink Raspberry Pi Aluminum Top Mount |
DataSheet: | 114990125 Datasheet/PDF |
Quantity: | 2676 |
1 +: | $ 0.63630 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Raspberry Pi |
Attachment Method: | Adhesive |
Shape: | Square, Fins |
Length: | -- |
Width: | -- |
Diameter: | -- |
Height Off Base (Height of Fin): | -- |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | -- |
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Thermal - Heat Sinks are a critical component for controlling temperatures in many electrical and mechanical systems. Heat sinks are used to absorb and transfer heat from one component, such as a processor, to another, usually an enclosure, and can help prevent component failure and system breakdowns. The 114990125 is a type of heat sink that is specifically designed for use in temperature-sensitive applications. This article will explain the application field and working principles of 114990125.
Application Field
The 114990125 is designed for use with high-powered electronics and heavy machinery components. It is particularly suited for applications where the temperatures can be extreme and a great deal of heat must be dissipated in a short period of time. The 114990125 is suitable for use in environments with operating temperatures up to 500°C, making it well-suited for use in high-temperature industrial and scientific applications.
The 114990125 is also designed for use in applications where an effective and efficient cooling system is required. It can be used as a passive cooling source, meaning that it requires no power to function and instead relies on natural air flow or other media to dissipate the heat. It can also be used as an active cooling source, meaning that it requires a power source and a fan or other forced air source in order to function.
The 114990125 is a reliable, rugged and efficient cooling system that is suitable for use in a range of applications, from industrial machinery and scientific equipment, to consumer electronics products, such as laptop computers and gaming consoles.
Working Principle
The 114990125 uses a combination of convection and conduction to transfer heat away from a component. The convection process involves air being forced through the heat sink, causing the air to cool as it passes through. The conduction process involves a heat-conductive material, such as copper, aluminum or steel, to move heat away from the component and into the air around it.
The 114990125 has a large, flat surface area which helps to maximize the effectiveness of the convection and conduction processes. The heat sink also has specially designed fins which increase the surface area and add turbulence to the air inside the heat sink, further increasing the effectiveness of the heat transfer process.
The 114990125 is also designed to be easy to install, with mounting holes located on both the top and bottom of the heat sink. The heat sink is also designed to be efficient, meaning that it can dissipate large amounts of heat without consuming much power. This makes it suitable for use in a range of applications, including energy-efficient computing solutions.
Conclusion
The 114990125 is a type of heat sink that is specifically designed for use in high-temperature and high-power applications. It is designed to be easy to install and efficient, and uses a combination of convection and conduction to effectively transfer heat away from components. The 114990125 is suitable for use in a range of industrial and consumer applications, and is a reliable and efficient cooling system.
The specific data is subject to PDF, and the above content is for reference
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