12-5-CN4490

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The 12-5-CN4490 is a shielding and absorbing material that is part of the family of Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) materials. The application field of the material is vast to ensure the reliable performance of any electronics in a variety of environments. The material offers high efficiency and highly effective shielding and absorbing capabilities.

The 12-5-CN4490 materials can be used to reduce or reflect RFI and EMI that could cause interference from unwanted signals. They can be used in automotive, military, and medical electronics, or in any other setting where electromagnetic energy needs to be shielded from other signals. In addition to shielding and absorbing, 12-5-CN4490 materials can also be used to provide thermal management in electronic systems.

The 12-5-CN4490 material is composed of a combination of high-conductivity metals alloys that are shielded using a high-density copper layer. An outer thermoplastic protection layer is then added to provide durability and to reduce crosstalk.

The working principle behind the 12-5-CN4490 materials is that it uses a combination of shielding, absorbing, and reflecting materials to protect electronic systems from RF and EMI. The material is designed to absorb and reflect the energy from RFI and EMI that can cause interference in the system. By reflecting and absorbing the energy, the 12-5-CN4490 materials can ensure that external signals are kept at bay.

In addition to shielding and absorbing, the 12-5-CN4490 materials are also capable of providing thermal management to protect delicate electronics from overheating. The material is composed of a combination of alloys and layers of thermal protection. These layers and alloys provide better heat dissipation and help keep the electronics running consistently at optimum temperatures.

In summary, the 12-5-CN4490 is an effective shielding and absorbing material that can be used to protect electronic systems from RFI and EMI. It is composed of a combination of high-conductivity metals alloys that are shielded using a high-density copper layer, and an outer thermoplastic protection layer to provide durability and reduce crosstalk. It works by absorbing and reflecting the energy from RFI and EMI, and it can also provide thermal management to ensure the consistent performance of delicate electronics.

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