Allicdata Part #: | 1003-2379-2-ND |
Manufacturer Part#: |
120220-0310 |
Price: | $ 0.00 |
Product Category: | RF/IF and RFID |
Manufacturer: | ITT Cannon, LLC |
Short Description: | MICRO UNIVERSAL CONTACT Z 1.3MM |
More Detail: | N/A |
DataSheet: | 120220-0310 Datasheet/PDF |
Quantity: | 123500 |
Material: | Titanium Copper |
Plating: | Nickel |
Plating - Thickness: | 118.11µin (3.00µm) |
Attachment Method: | Solder |
Operating Temperature: | -- |
Series: | -- |
Part Status: | Active |
Type: | Shield Finger, Pre-Loaded |
Shape: | -- |
Width: | 0.038" (0.96mm) |
Length: | 0.093" (2.37mm) |
Height: | 0.051" (1.30mm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Radio frequency interference (RFI) and electromagnetic interference (EMI) originate from a variety of sources and can create problems in electrical and electronic systems. Reducing this interference requires devices with specialized electrical and mechanical properties to provide shielding from the RFI and EMI emissions. Contacts, fingerstock and gaskets are a type of mechanical shielding used in RFI and EMI applications, and their design, application and working principle will be discussed in this article.
Contacts are metal parts with low electrical resistance that are used between components to ensure a reliable electrical connection. The metal is usually a copper alloy and can be either braid, tape, foil or solder. Contacts are designed to fit into contact points on either side of a circuit board or other electrical component. Depending on the application, contacts may need to be spring loaded, insulated or have a self-locking mechanism.
Fingerstocks are strips of conductive metal material that are soldered to circuit boards to ensure reliable electrical contact. They are available in a variety of sizes and shapes, and can be used for both shielding and electrical connections. Fingerstocks are made of copper, silver or other metals and are usually coated with a protective layer to improve the conductive properties. They are commonly used to provide shielding between two components, or to connect multiple circuit boards together.
Gaskets are hollow, ring-shaped pieces of metal used to create a seal between two components. They are usually made of stainless steel, copper or aluminum, and are designed to fit tightly around the component or board. Gaskets are typically soldered or screwed into place, and can provide a great degree of shielding against RFI and EMI emissions. Gaskets are also used to provide a physical connection between two components.
All three types of RFI and EMI shielding devices provide a physical, mechanical barrier between the components or boards, and prevent the passage of electrical signals. These barriers block out interference from external sources and prevent interference from escaping the device. Contacts provide a reliable low-resistance electrical connection between the components, while fingerstocks ensure electrical contact. Gaskets provide a physical connection, as well as shielding from RFI and EMI.
Using these three devices together provides the best protection against RFI and EMI in electrical and electronic systems. The shields should be carefully designed to ensure that cold solder joints are minimized and proper contact is maintained throughout the entire system. Proper installation will ensure that the shields are not overly compressed, as this can damage the device and prevent the shielding from being effective. The shields should also be inspected regularly to ensure that they are securely fastened and in proper working order.
RF and EMI shielding is an essential part of any electrical or electronic system. Proper shielding is essential to keep interference out of systems, and prevent the transmission of interference to other systems or components. In order to maximize shielding effectiveness, it is important to use specialized devices such as contacts, fingerstocks and gaskets to provide reliable and secure shielding against RFI and EMI emissions.
The specific data is subject to PDF, and the above content is for reference
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