121719_REV1 Allicdata Electronics
Allicdata Part #:

345-1445-ND

Manufacturer Part#:

121719_REV1

Price: $ 8.16
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: FLAT HEAT PIPE 8.4X2.5X250MM
More Detail: Heat Sink Copper Heat Pipe
DataSheet: 121719_REV1 datasheet121719_REV1 Datasheet/PDF
Quantity: 71
1 +: $ 7.42140
10 +: $ 7.00938
25 +: $ 6.59711
50 +: $ 6.18484
100 +: $ 5.77250
250 +: $ 5.36019
500 +: $ 5.25711
1000 +: $ 5.15403
Stock 71Can Ship Immediately
$ 8.16
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Package Cooled: --
Attachment Method: --
Shape: Flat
Length: 9.843" (250.00mm)
Width: 0.330" (8.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.098" (2.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks make use of 121719_REV1 technology in various applications.

One of these applications is in cooling components, sensors and electronics, which are subjected to extremely high temperatures. 121719_REV1 is an advanced thermal-technology that is used in cooling components such as transistors, diodes, bridges, and other devices. This technology makes use of a combination of air cooling and liquid cooling to efficiently reduce the temperature of heat-producing components.

The working principle of 121719_REV1 technology is simple. It relies on the transfer of heat from the source components to a suitable cooling medium. Heat sinks are used to dissipate the heat energy generated by the components. The cooling medium is usually either air or water, each of which works differently in dissipating heat energy.

In air-cooled applications, air is used as the cooling medium and is sucked in through vents and dissipated through fins and other heat dissipating materials. This is effective for small electronics components but is typically not sufficient to cool large components. For these applications, liquid-cooled solutions may be more appropriate.

Liquid-cooled systems make use of a combination of water and antifreeze as the cooling solution. The liquid flows through a closed loop system, absorbs the thermal energy from the electronics components, and then carries it away to a radiator or other heat exchanging system. The cooled liquid is then returned to the source components to absorb more heat and repeat the cycle. This method of heat dissipation is more efficient and is typically used for cooling larger components and systems.

In addition to cooling components, 121719_REV1 technology can also be used to improve the efficiency of thermal power plants. By utilizing the same type of heat dissipating materials used in air and liquid cooled solutions, thermal power plants can increase their power output by improving their thermal efficiency. This can result in lower fuel costs and improved overall efficiency.

121719_REV1 is also being used in the automotive industry for cooling the engine and other components. Heat sinks are used to dissipate the heat generated by the engine and other parts, which helps to maintain optimal temperatures and reduce the risk of component failure.

121719_REV1 technology is also used in the telecommunications industry for cooling transmitters, receivers, and other equipment. This makes use of both air and liquid cooling solutions, depending on the size and complexity of the equipment involved. In addition, this technology is also used for cooling heavy duty server farms.

121719_REV1 technology has become an increasingly important part of many industries. By improving the performance and efficiency of thermal components and systems, this technology is helping to reduce costs and improve performance.

The specific data is subject to PDF, and the above content is for reference

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