122261 Allicdata Electronics
Allicdata Part #:

345-1470-ND

Manufacturer Part#:

122261

Price: $ 80.62
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK 19584 PROFILE 12"
More Detail: Heat Sink Power Modules Aluminum Top Mount
DataSheet: 122261 datasheet122261 Datasheet/PDF
Quantity: 18
1 +: $ 73.29420
10 +: $ 68.71100
25 +: $ 64.13020
50 +: $ 61.83980
100 +: $ 59.54940
Stock 18Can Ship Immediately
$ 80.62
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: Power Modules
Attachment Method: Adhesive
Shape: Rectangular, Fins
Length: 12.000" (304.80mm)
Width: 11.000" (279.40mm)
Diameter: --
Height Off Base (Height of Fin): 1.375" (34.93mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Unfinished
Description

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Thermal - Heat Sinks

122261 Application Field and Working Principle are related to thermal heat sinks. Thus, the discussion in this text will be about the field of application and working principle of heat sinks. Thermal heat sinks are utilized for heat-dissipation purposes by providing a mechanism through which heat can be taken away from an electrical component. This is done in order to help reduce the operating temperature of the electrical components. Heat sinks have been around for many years and they have evolved over time to better suit the requirements of modern electrical systems.

The field of application of thermal heat sinks is mainly used in the cooling of electronic components. This is done by utilizing a metal casing which absorbs or radiates thermal energy away from the electrical components. Heat sinks can also be used in other thermal processes where the dissipation of heat is necessary, such as in the production of high-performance automotive and other industrial components. Heat sinks are also used in the cooling of computers, as their design allows for a relatively low rate of heat absorption.

The working principle of thermal heat sinks lies in the rate of thermal energy transfer between the electrical component and the heat sink. As the temperature of the electrical component increases, the rate of heat transfer is also increased. This can be done through conduction or radiation. Conduction occurs when the heat is transferred by direct contact between the electrical component and the heat sink, while radiation occurs when heat is transferred through the air. A heat sink is designed to provide a greater level of thermal efficiency by providing a larger surface area for heat to be transferred to, and thus increase the rate of heat dissipation from the electrical component.

The size of the heat sink is an important factor in determining its efficiency. The larger the heat sink, the more area is available for heat to be transferred to, which will lead to better dissipation of heat from the electrical component. Heat sinks are also designed with fins for better heat dissipation. As air passes over the fins, it carries away thermal energy from the electrical component. Heat sinks are often utilized in conjunction with other heat-dissipation techniques such as fans, to ensure maximum cooling efficiency.

In conclusion, 122261 Application Field and Working Principle are related to thermal heat sinks. They are mainly used to dissipate heat from electrical components, by utilizing a metal casing which absorbs or radiates thermal energy away from the electrical components. The rate of heat transfer between the electrical component and the heat sink is regulated by the size of the heat sink, and the use of fins to increase the surface area available for heat dissipation. Thermal heat sinks are an important technology in maintaining the performance and safety of electrical systems.

The specific data is subject to PDF, and the above content is for reference

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