Allicdata Part #: | 345-1472-ND |
Manufacturer Part#: |
122263 |
Price: | $ 70.87 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK 16681 PROFILE 12" |
More Detail: | Heat Sink Power Modules Aluminum Top Mount |
DataSheet: | 122263 Datasheet/PDF |
Quantity: | 25 |
1 +: | $ 64.42380 |
10 +: | $ 60.39750 |
25 +: | $ 56.37110 |
50 +: | $ 54.35780 |
100 +: | $ 52.34450 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Power Modules |
Attachment Method: | Adhesive |
Shape: | Rectangular, Fins |
Length: | 12.000" (304.80mm) |
Width: | 8.400" (213.36mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.400" (35.56mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Unfinished |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are an important technology used for cooling electronics, such as computer processors and graphics cards. Heat sinks are devices that use heat flow between two objects to dissipate, absorb or transfer thermal energy. They maintain maximum temperature levels while increasing the average object\'s ability to safely store and transfer heat.
The 122263 Application Field and Working Principle of Thermal-Heat Sinks is based on convection, radiation and conduction heat transfer mechanisms to reduce object temperature. It is based on the principle that a heat sink will absorb heat from an area or object, then use its own heat absorption process to dissipate heat away from the area or object. This is achieved by releasing heat from the area or object, or from the heat sink itself. Depending on the heat sink\'s design, the primary method of heat release may be either convection, radiation or conduction.
The most common type of heat sink is a base plate with fins attached to it. The base plate is typically made of aluminum or copper, which has a high thermal conductivity. The fins are typically made of aluminum and they allow air to flow between them. Heat is absorbed from the object and transferred to the fins using conduction heat transfer. The fins then release the heat into the surrounding air using convection heat transfer.
Radiation heat transfer is also used in heat sinks, but it is typically only used when the object has to be cooled from a large distance. Radiation heat transfer is the transfer of heat from the object to the ambient air without the aid of any physical medium. Radiation heat transfer works because hot objects emit radiations which transfer the heat to the cooler object.
A typical application for thermal-heat sinks is in gaming laptops. The laptop’s processor and graphics card tend to generate a lot of heat. Heat sinks are used to keep the temperature of the components within an optimal range. The fins of the heat sink absorb heat from the components and then transfer the heat into the surrounding air using convection. Radiation heat transfer may also be used in some cases to cool components from a large distance.
Thermal-heat sinks are also used in servers, high powered PCs and industrial machines. They are often used in applications where tight temperature control is required. Heat sinks can greatly reduce the temperature of components, allowing for improved heat management. Additionally, heat sinks are used to transfer heat away from circuit boards and components that cannot tolerate large amounts of heat.
In summary, thermal-heat sinks are an important technology used for cooling electronics. Heat sinks work using convection, radiation and conduction heat transfer mechanisms to reduce object temperature. Heat sinks are commonly used in gaming laptops, servers, high powered PCs and industrial machines. With their help, devices can stay cooler and have improved heat management. And that is the applications field and working principle of thermal-heat sinks.
The specific data is subject to PDF, and the above content is for reference
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