Allicdata Part #: | 345-1496-ND |
Manufacturer Part#: |
122551 |
Price: | $ 18.74 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK EXTRUSION 12.32" |
More Detail: | Heat Sink Power Modules Aluminum Top Mount |
DataSheet: | 122551 Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 17.03520 |
10 +: | $ 16.03480 |
25 +: | $ 15.03260 |
50 +: | $ 14.03050 |
100 +: | $ 13.52930 |
250 +: | $ 12.77770 |
500 +: | $ 12.52720 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Power Modules |
Attachment Method: | Adhesive |
Shape: | Rectangular, Fins |
Length: | 12.320" (312.93mm) |
Width: | 3.420" (86.87mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.630" (41.40mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 30.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 0.95°C/W |
Material: | Aluminum |
Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
122551 Application Field and Working Principle
Heat sinks are devices used to effectively dissipate heat generated by various components in various fields, including electronics, aerospace, engineering, and communication. The 122551 heat sink is a kind of advanced thermal solution specially designed to be used in high-end and power semiconductors workspaces. It is characterized by a great thermal conductivity, an excellent heat dissipation, and long lasting operation, which makes it ideal for a wide range of applications.
Fields of Application
The 122551 heat sink is suitable for use in applications such as aerospace and automotive workspaces, semiconductor products, and communication systems. It is also suitable for power electronic components and devices, such as digital signal processing and switches. It can also be used in industrial workspaces, such as oil and gas plants and waste water treatment plants. Additionally, it is suitable for use in cooling computer processors, high-speed processors, and other electronic systems.
Working Principle
The working principle of the 122551 heat sink is based on the principle of thermal energy transfer. The heat sink works by absorbing the heat generated by a component and transferring it to an environment with lower temperature. Heat sinks use a combination of vapor chamber technology, copper fins, and air-flow designs to transfer the heat from the component to the environment. The copper fins and vapor chambers are responsible for absorbing and dissipating the heat, while the air-flow design ensures efficient air circulation.
The heat sink has a special construction that enables it to reduce the thermal resistance between the component and the environment. This reduces the temperature of the component and the environment. The heat sink also includes a thermal pad that provides greater heat dissipation efficiency. The thermal pad re-distributes the heat over a larger area, thus increasing the heat dissipation rate.
Conclusion
The 122551 heat sink is a reliable thermal solution that is used in a wide range of applications. It has excellent thermal conductivity, a great heat dissipation rate, and a long lasting operation. The heat sink also provides a special construction for reducing the thermal resistance between the component and the environment. In conclusion, the 122551 heat sink is a great thermal solution for various workspaces and applications.
The specific data is subject to PDF, and the above content is for reference
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