133-11B9 Allicdata Electronics
Allicdata Part #:

133-11B9-ND

Manufacturer Part#:

133-11B9

Price: $ 59.56
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK EXTRUDED
More Detail: Heat Sink
DataSheet: 133-11B9 datasheet133-11B9 Datasheet/PDF
Quantity: 1000
25 +: $ 53.60070
Stock 1000Can Ship Immediately
$ 59.56
Specifications
Series: 133
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal management is essential for electronic applications in order to maintain peak performance and reliability. Thermal - Heat Sinks provide an effective way of dissipating heat from electronic components and boards. As the name suggests, these sinks absorb and dissipate heat from the electronic components to keep them from overheating.The 133-11B9 is a thermal-heat sink that can be used in a wide variety of applications. It has a compact design and is highly reliable due to its low profile and efficient fins. Additionally, this heat sink has a thermally conductive material that efficiently conducts heat from the source to the fins, where it is dissipated into the surrounding air. The 133-11B9 is an ideal choice for applications that require high performance and thermal management.The 133-11B9 is suitable for applications such as power supplies and amplifiers. In power supplies, this thermal-heat sink is used to manage the temperatures of the components and dissipate the heat generated from them. It is also used in amplifiers to reduce the temperature of the components and ensure peak performance of the amplifier for a longer duration.The 133-11B9 has a wide operating range, which makes it ideal for applications with varying temperature ranges. It can also handle high-powered applications, such as motor drives and inverters, as it has a high maximum operating temperature of 125°C.The working principle of the 133-11B9 is simple. It consists of a thermally conductive base where the heat source is placed, and a fin array that is directly exposed to the ambient air. The thermally conductive base absorbs heat from the heat source and transfers it to the fins. The fin array is designed to be wide and has a high surface area which allows for effective convection of the heat into the surrounding air. This transfer of heat helps to keep the heat source from overheating and maintains its peak performance.The 133-11B9 is a reliable thermal-heat sink and is recommended for applications that require both reliable thermal management and high performance. It is easy to install and provides effective heat dissipation for a wide range of temperature ranges. It is a great option for applications such as power supplies, amplifiers, timers, and motor drives.

The specific data is subject to PDF, and the above content is for reference

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