1542011-3 Allicdata Electronics
Allicdata Part #:

1542011-3-ND

Manufacturer Part#:

1542011-3

Price: $ 9.71
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 29MM HEATSINK ASSEMBLY
More Detail: Heat Sink
DataSheet: 1542011-3 datasheet1542011-3 Datasheet/PDF
Quantity: 1000
250 +: $ 8.73873
Stock 1000Can Ship Immediately
$ 9.71
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks

Heat sinks are efficient and cost effective components that are designed to dissipate heat away from sensitive electronic circuitry. Through their design, heat sinks are able to level temperatures within electronic equipment, preventing it from overheating and causing irreversible damage.The thermal characteristics of a heat sink can be described with the thermal resistance, known as the thermal resistance coefficient (Rth). The value of an Rth coefficient is dependent upon a variety of factors, including the size and shape of the heat sink, the type of material used, as well as the two thermal resistance mediums that ensure efficient heat transfer.The first medium is the conduction material that provides the thermal bridge between the electronic component and the heat sink. Thermal conductive materials, such as thermal grease, tape or paste, are commonly used to fill the gap between the two components, and allow the heat generated from the component to be efficiently transferred to the heat sink. The conduction material is responsible for streamlining the flow of heat away from the component to the heat sink.The second decision to consider when choosing a heat sink is the thermal resistance of the medium. Many thermal resistance mediums, such as air, oil and olefin polymers, are used to provide an efficient flow of heat away from the component and to the surrounding environment.When choosing a heat sink, every factor needs to be taken into consideration. Factors such as the size, shape and materials used are all important considerations to make in order to ensure the heatsink is properly designed to dissipate the amount of heat that needs to be managed.One of the most popular materials used for heat sinks is aluminum. Aluminum has a low thermal resistance that allows it to efficiently dissipate heat and has excellent thermal conductivity. In addition, aluminum has a high strength to weight ratio that is beneficial for high performance heat sinks. Other materials, such as copper molybdenum, zinc-cobalt and carbon-graphite, are also used to design effective heat sinks, and each material has its own unique advantages and disadvantages in terms of performance. The most basic type of heat sink is the standard aluminum finned variety. These heat sinks feature a series of aluminum fins that are designed to increase the surface area, which allows for greater heat dissipation. An evaporative fin heat sink design is also common, and this type of heat sink uses an evaporative cooling process, where the heat is dispersed through a thin vapor film.The use of liquid-cooled heat sinks is also common in electronics, and these are designed to use cooling liquids or chilled air to keep the temperature of the electronics within safe limits. Liquid-cooled heat sinks come in two common types: air-cooled and fluid-cooled. Air-cooled heat sinks are designed to use air to carry away the heat, and are often supplemented by the use of fans. Fans are used to assist with air movement across the surface area of the heat sink, resulting in less thermal resistance and increased cooling capacity. Fluid-cooled heat sinks are designed to use a liquid or gas coolant that helps to carry away heat from the component in question. This type of heat sink typically requires the use of a closed-loop pump system for effective heat transfer.Heat pipes are also used to supplement heat sink designs. Heat pipes are sealed tubes that are filled with water and fitted with a special wick absorbent material. When heated, the water evaporates and is then carried to the other end of the tube, reintroducing the energy back into the heat sink, where it is then cooled. This process is then repeated over and over again, offering a continuous cooling cycle.Heat sink designs have come a long way in recent years, and they are now considered to be essential components for ensuring optimal performance and longevity in electronic systems. Different designs, materials and thermal resistance mediums all play an important role in creating an effective heat sink, and care should be taken to research and choose the most appropriate for the application. By doing so, each heat sink component is able to provide a reliable and dependable method for dissipating heat away from sensitive electronics, thereby controlling temperature levels and improving overall performance.

The specific data is subject to PDF, and the above content is for reference

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