1542216-3 Allicdata Electronics
Allicdata Part #:

1542216-3-ND

Manufacturer Part#:

1542216-3

Price: $ 3.40
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: HTS523-3=HS PLTD CL INTERFACE
More Detail: Heat Sink
DataSheet: 1542216-3 datasheet1542216-3 Datasheet/PDF
Quantity: 1000
300 +: $ 3.08700
Stock 1000Can Ship Immediately
$ 3.4
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks have been around for decades, but the technology behind them has been changing constantly. In this article, we\'ll look at the application field and working principle of the 1542216-3 thermal heat sink.

The 1542216-3 thermal heat sink is characterized by its unique cylindrical design, and it is an excellent choice for cooling high-powered electronics. This is because a cylindrical heat sink has a much larger surface area per unit volume than a rectangular heat sink, allowing more efficient heat dissipation. The 1542216-3 also features a unique fin configuration that maximizes airflow and heat dissipation.

The 1542216-3 heat sink is most commonly used in high-powered electronics, such as servers, workstations, and other similar equipment. It is also well-suited for use in demanding computing and gaming applications. The heat sink is designed to dissipate the large quantities of heat generated by these CPUs while keeping noise levels at an acceptable level.

The working principle of the 1542216-3 is relatively simple. As heat is created by the processor, it is transferred to the heat sink through a copper heat spreader. The heat spreader is responsible for distributing the heat evenly across the heat sink\'s surface. Once the heat reaches the heat sink, it is dissipated into the atmosphere due to the convection of air around the heat sink.

The fins of the 1542216-3 are specially designed for efficient air flow, and they also increase the overall surface area of the heat sink. As air passes over the fins, they draw off the heat from the heat sink. This ensures that the heat is effectively dissipated and that the system remains cool.

The 1542216-3 thermal heat sink is also designed to be efficient in other areas. For example, the heat sink includes a thermal compound paste that optimizes the connection between the heat spreader and the heat sink, thereby reducing thermal resistance. Additionally, the heat sink is constructed from a lightweight aluminum alloy that is both durable and lightweight, making it ideal for mobile applications.

Finally, the 1542216-3 thermal heat sink is easy to install and compatible with most popular computer cases. The heat sink includes a detailed instruction manual and mounting hardware, making installation a breeze. It is also supported by a range of support tools and resources provided by the manufacturer.

In conclusion, the 1542216-3 thermal heat sink is an excellent choice for cooling high-powered electronics. Its cylindrical design provides a larger surface area for efficient heat dissipation, while its fins and thermal paste optimization ensures that the heat is dissipated quickly and efficiently. Additionally, it is easy to install and compatible with most popular computer cases.

The specific data is subject to PDF, and the above content is for reference

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