1703355104

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Introduction

Backplane connectors (1703355104) provide ground and power connection as well as signal transfer capabilities to an interconnection system. The 1703355104 backplane connector is a specialized type of connector specifically designed for connecting two boards electrically while maintaining structural integrity between them. It is a high-performance device that ensures that signals and power can be transferred across different board connection interface systems without suffering cross-talk, ground loops, or other signal integrity issues that can occur in other types of backplane connectors.

Application Field

The 1703355104 backplane connector is used in applications such as computer and data processing, telecommunications equipment, test and measurement instruments, space, military and aerospace applications. It is also used for interconnection of printed circuit boards (PCB) or PCBs to other backplane components. This type of backplane connector is well-suited for applications requiring dense packaging of multiple boards with very high data rates. In addition, these connectors are also used for hot-swappable applications, where physical and electrical connections are made and changed while the system is still powered.

Working Principle

The 1703355104 backplane connector works by providing tight board-to-board coupling during the connection process. The connection process allows the complete line of connectors to be mated simultaneously without the need for manual pin alignment. This type of connector also provides a tight connection between boards, ensuring reliable power, signal, and structural support. The design of the 1703355104 connector also minimizes concern for ground loops and signal integrity issues. The connector may include a unique design where the pins are configured to make the best possible connection between the boards even when the boards are misaligned.

Conclusion

The 1703355104 backplane connector is a specialized type of connector specifically designed for connecting two boards electrically while maintaining structural integrity between them. It is suitable for applications requiring dense packaging of multiple boards with very high data rates and for hot-swappable applications. Its design also minimizes concern for ground loops and signal integrity issues, providing a tight connection between boards with reliable power, signal, and structural support.

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