1721590211 Allicdata Electronics
Allicdata Part #:

1721590211-ND

Manufacturer Part#:

1721590211

Price: $ 0.26
Product Category:

Connectors, Interconnects

Manufacturer: Molex, LLC
Short Description: CONN CARDEDGE HSG 11POS .156 WHT
More Detail: 11 Position Card Edge Connector Housing White 0.15...
DataSheet: 1721590211 datasheet1721590211 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
3000 +: $ 0.23331
Stock 1000Can Ship Immediately
$ 0.26
Specifications
Series: EDGEMATE™ 172159
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Card Type: Non Specified - Single Edge
Number of Positions: 11
Card Thickness: 0.062" (1.57mm)
Pitch: 0.156" (3.96mm)
Features: Latch Lock
Mounting Type: Free Hanging (In-Line)
Color: White
Flange Feature: --
Material - Insulation: Polyamide (PA), Nylon
Note: Contacts Not Included
Material Flammability Rating: UL94 V-2
Operating Temperature: 0°C ~ 75°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Card Edge Connectors - Housings are an important component of many modern devices, systems, and applications. A Card Edge Connector - Housing or CEC-H is a device connected to a circuit board or other electronic device. The CEC-H consists of an outer metal or plastic shell with an inner portion of metal or plastic intended to carry through-hole-mounted integrated circuits or other electrical components. Through-hole and surface-mount pins on the connector allow for the transfer of electrical signals between the components, and the outer shell provides a mounting surface for the electrical components.

The 1721590211 Card Edge Connector - Housing is designed for applications such as those in telecommunications, consumer electronics, computing, automotive, and other industrial and medical applications. This model features an insulated housing and all necessary supporting electronics in a single integrated housing. This integrated approach helps reduce overall cost, complexity, and size of a solution, while ensuring reliable operation.

The 1721590211 CEC-H is constructed from a lightweight and durable UV-resistant, heat-resistant plastic material, making it an ideal solution for applications in which harsh environmental environments are present. Additionally, the CEC-H can tolerate temperatures up to 250 Celsius, making it suitable for high-temperature applications. The CEC-H is available in different sizes to meet the needs of a variety of applications.

The 1721590211 CEC-H is designed to accommodate surface-mount and through-hole components, allowing for the integration of different types of components into the overall product. The CEC-H also features an integrated heat sink, which helps in dissipating heat generated by the components that it carries. Additionally, the CEC-H provides integrated ESD protection, preventing the components from being damaged by electrical surges.

The 1721590211 CEC-H works through a simple process. To begin, an electrical signal is sent through a pin on the CEC-H, which acts as an antenna. This signal is then transmitted through the integrated electronics and transferred to an integrated circuit, which then processes the signal. Once the signal has been processed, the output is returned to the integrated circuit and then sent back out through a different pin on the CEC-H. Once the signal has been sent, the CEC-H then acts as a shield to protect the components it is carrying from outside interference.

The 1721590211 CEC-H is an ideal solution for applications requiring reliable and cost-effective connectivity solutions. Its integrated design, ESD protection, and heat sink help reduce the cost and complexity of a solution, while ensuring reliable operation in harsh environments. Additionally, its ability to accommodate both surface-mount and through-hole components makes it a versatile and cost-effective solution for many applications.

The specific data is subject to PDF, and the above content is for reference

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