174-E50-113R241

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D-Sub Connectors are a type of electrical connector used to transmit signals from one device to another. The 174-E50-113R241 is a specific type of D-Sub connector which is designed for an industrial mission critical application. It was designed to provide reliable and robust performance in very harsh and potentially hazardous environments.

The 174-E50-113R241 is engineered for high performance and excellent durability even in the most demanding industrial applications. It features an anti-vibration design and a molded rubber seal to help protect against dirt, dust, and water. It is also designed to withstand extreme temperature variations and can be used at temperatures ranging from -40 to +220°C.

The 174-E50-113R241 is a highly versatile connector that can be used in a variety of applications. It is commonly used in industrial automation and control systems, motion control systems, factory automation, aerospace applications, medical instruments, and more. It has been successfully used in some of the most demanding industrial environments.

The 174-E50-113R241 is a two-row, 50 conductor D-Sub connector that is designed to meet MIL-STD-1344 class 4 specifications. It is capable of carrying up to 40 amps and 250 volts and the molded backshell helps ensure a reliable and secure connection. It is also resistant to shock and vibration, making it an ideal choice for extreme industrial environments.

The 174-E50-113R241 is designed to connect two external devices together and is typically used in applications where high data transfer rates are needed. It is perfect for applications where high speed signals are needed such as Ethernet, USB, and CAN. The shielding on the backshell of the connector helps reduce noise and crosstalk, making it a great choice for data intensive applications.

In conclusion, the D-Sub Connectors are a reliable and robust type of electrical connector. The 174-E50-113R241 specifically is designed to meet the demanding requirements of some of the most extreme industrial applications. It is capable of high-performance data transfer and is resistant to harsh conditions and shock and vibration. This makes it an ideal choice for data intensive, mission critical applications.

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