1757321-1

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ARINC is one of the leading manufactures of backplane connectors and the 1757321-1 is the number assigned to one of the advanced series they carry. This series of connectors carries ruggedness, aesthetics, reliability through consistent field performance, even in extreme temperatures. The 1757321-1 carries the following features:

• It has 4-way slides that provide versatility
• Power contacts in the connector offer maximum transmission ability between the backplane
• It has an NSE plastic housing that helps to reduce EMI/RFI emissions
• A variety of mounting styles and configurations are offered

The applications of the ARINC 1757321-1 series include aerospace and defense, satellite communication systems, power, medical electronics and remote sensor systems. The rugged design of these connectors allows for increased reliability and extended service life. The variety of configurations, styles and contact designs allow the engineer to meet a wide set of requirements in any application. The sealed housing prevents environmental and electrical issues such as ingress, dust and moisture.

The working principle of the ARINC 1757321-1 backplane connectors utilizes the NSE plastic housing and 4-way slides to provide an effective seal between the backplane and the rear panel. This design offers a secure and reliable connection for the power contacts.The 4-way slides have an easy-to-use activation handle which enables the user to engage and disengage the panel. The contacts are spring loaded which ensures that the electrical connection is maintained with a minimum of retention force. The retention force applied by the contacts increases as the power dissipation increases which allows for a safe and reliable electrical connection.

The ARINC 1757321-1 backplane connector offers a flexible and rugged design with a wide variety of mounting styles and configurations. Its sealed housing, activatable handles and spring-loaded contacts ensure a reliable and secure electrical connection. This connector is an ideal choice for applications in extreme temperatures and hostile environments, as well as satellite communication, remote sensing systems, and medical electronics.

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