1757543-3 Connectors, Interconnects

ARINC 1757543-3 backplane connectors provide high-speed board-to-board connections with precision and reliability. This ARINC backplane connector is designed for high performance applications, making it ideal for power, high data rates, and multi-terabit interconnects. The 1757543-3 backplane connector is comprised of two flat die components and two plug die components. The module provides the highest bandwidth of any ARINC backplane connector.

The 1757543-3 application field includes automotive, medical, aerospace, defense, and computing. It also can be used as high speed backplane interconnects for high performance rack/shelf systems, and for PCB-to-PCB or board-to-board interconnects. This backplane connector is suitable for a wide variety of industrial applications that demand data rate support up to 8.3 Gbps and 500 Mbps. With a wide frequency range of 1GHz-8GHz, these backplane connectors are suitable for high-speed backplane designs.

The working principle of the 1757543-3 backplane connector is based on the use of a high-speed differential pair structure. Each differential pair includes two signal contacts, which are separated from each other and allowed to float within the flat die at the same level. This ensures that they are not affected by external contact forces or misalignment. The two plug die components are designed to connect the two flat die components, ensuring a good contact between the two signal contacts. This unique design allows the ARINC 1757543-3 backplane connector to achieve high performance for both power and high-speed data transmission.

ARINC 1757543-3 backplane connectors are designed for increased current carrying capacity, better signal integrity, and to meet the harsh environmental requirements of many demanding applications. This connector is rated for vibration, shock, thermal shock, and high temperature cycling, making it suitable for use in many different applications. Additionally, the ARINC 1757543-3 backplane connectors feature an injection-molded plastic housing that provides additional protection for the signal contacts. This plastic housing also helps minimize EMI/EMC radiation.

In summary, the ARINC 1757543-3 backplane connector provides the highest bandwidth of any ARINC backplane connector. It is designed for increased current carrying capacity, better signal integrity, and to meet harsh environmental requirements. The module is suitable for a wide variety of industrial applications that demand data rate support up to 8.3 Gbps and 500 Mbps, with a wide frequency range of 1GHz-8GHz. Additionally, the ARINC 1757543-3 backplane connector features an injection-molded plastic housing that provides additional protection for the signal contacts.