1766817-1

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Backplane Connectors - Contacts

1766817-1 contacts are an increasingly popular form of backplane connector used in data communication and other electronic applications. The contacts are designed to provide reliable interconnection between two boards while allowing for highly efficient signal transmission and power dissipation. These features make this type of backplane connector an ideal solution for demanding applications in telecommunications, networking, test and measurement, semiconductor, research and development, and industrial systems.

Overview

The 1766817-1 connector family includes a range of both single-ended and differential-type contacts, configured in varied spacing, port configurations, contact arrangements, and contact stock thicknesses. The contacts are available in through-hole mount, surface mount, solder mount, board-to-board, and flex compatible types, making them ideal for a variety of applications. The contacts are equipped with electroplated contact surface finishes that provide added durability for high reliability interconnections.

These contacts feature high-density, low-profile designs that minimize backplane size by producing the greatest connection density with the least amount of space required for mounting. This reduces the space required to fit boards while more efficiently transferring data. The contacts are high-performance, capable of transmitting signals and power up to 6 Gbps. 1766817-1 contacts are also Low-Endurance Level Three (LE-3) compliant, making them suitable for short, temporary usage.

Design Specifications and Characteristics

1766817-1 contacts are available in a range of spacing configurations that provide various levels of connection density and mating capability. Common spacing options include 1.00 mm, 2.00 mm, 2.50 mm, and 3.00 mm, in various contact lengths as required. The contact stock thickness is also adjustable, with common thickness gauges of 0.20 mm, 0.22 mm, 0.25 mm, and 0.30 mm available.

The contacts’ mating area is plated for improved reliability and durability, while the contact surface finish options of gold, tin, nickel and silver improve compliance with industry standards and reduce the risks associated with poor contact mating. These contact features allow the connectors to provide reliable, lasting backplane connections.

Working Principle and Typical Applications

The design philosophy behind 1766817-1 contacts involves mating two accessories, often referred to as a stack or board, to form the backplane. The contact is fully inserted into one of the two boards, then the other board is inserted on top of the contact so that it nestles against the mating area of the contact.

The use of contact pressure ensures that the modules are securely mated to the board, preventing accidental disconnection. When fully mated, the contact’s inner face comes into contact with the mating face of the backplane, carrying both power and data signals. This eliminates the need for additional mating hardware and connections.

Thanks to their reliability, performance, and low power requirements, 1766817-1 contacts are a popular choice for backplane connectors in data communication, networking, test and measurement, semiconductor, research and development, and industrial systems. The variety of spacing and mounting configurations also allow for the connectors to be used in many specialized applications.

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