Allicdata Part #: | A120426-ND |
Manufacturer Part#: |
1857992-1 |
Price: | $ 5.08 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | CONN HEADER Z-PACK |
More Detail: | 110 Position Receptacle, Female Sockets Connector ... |
DataSheet: | 1857992-1 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Not applicable / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
336 +: | $ 4.62578 |
Series: | Z-PACK |
Packaging: | Tube |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Type: | Receptacle, Female Sockets |
Connector Style: | -- |
Number of Positions: | 110 |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 |
Mounting Type: | Board Edge, Through Hole, Right Angle |
Termination: | Press-Fit |
Connector Usage: | -- |
Contact Finish: | -- |
Contact Finish Thickness: | -- |
Current Rating: | 1.5A |
Voltage Rating: | 500Vrms |
Operating Temperature: | -55°C ~ 125°C |
Features: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Backplane connectors are among the most essential components in electronic systems designed to support high-speed, high-density communication. Such systems include embedded applications, high-performance computing, storage, and networking systems.
1857992-1 backplane connectors are a type of Hard Metric (HM) series of backplane connectors developed by Amphenol. As a variant of the Hard Metric connector series, it follows a unique standardization for size, contact pitch, mated stack height, and connector density.
The 1857992-1 is a double High-Density Mezzanine Card Industry Standard (HMCD) Dual-Row hybrid connector system with stacking heights of 5.1mm and 8.9mm. The pairing arrangement is a dual-row 9+10 configuration, which supports various contact sizes from 6.3mm to 10mm, including 12 positions in the 10mm double row layout. This connector system maximizes system-level density by allowing designers to optimize mating, stack-height and pin-count in order to minimize printed circuit board real-estate. The system allows for an increased number of contacts in limited space in comparison to the traditional I/O connections.
In this 1857992-1 series, traditional contact sizes range from 7.4 to 6.3 mm, offering customers a variety of contact sizes for application-specific solutions. Furthermore, an interface with a snap-fit flange ensures stability of the connector, providing a strong assembly that lasts in different environmental conditions. It is also designed to be compatible with existing unitized second-level miniaturization connectors as well as traditional I/O connection systems.
The 1857992-1 connector also includes an EMI protective shield, as the connector remains operational in high-speed environments. It is equipped with a low-profile shielding system, which helps protect components and circuitry from interference and crosstalk. Moreover, it is compliant with the current industry EMI signal standards, providing engineers with an effective solution to minimize EMI occurrences in-system. Along with this, contacts are enclosed within a durable insulator, ensuring reliable electrical performance while still being able to keep up with the diverse system environments.
The backplane connector system is also highly-reliable, as it features an elliptically-tapered contact design that offers controlled mating. This design reduces contact resistance, minimizes back-out forces, and improves durability of the contact system, providing longer and higher-quality contact performance in a wide range of conditions. In addition, the 1857992-1 is RoHS compliant and UL Recognized, making it safe for use in high-performance applications.
In short, the 1857992-1 cable interface system is an excellent choice for high-performance applications where contact count and space savings is of utmost importance. With its optimized design, it helps maximize contact density, increase contact reliability, and offer excellent EMI protection.
The specific data is subject to PDF, and the above content is for reference
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