1892813-1 Allicdata Electronics
Allicdata Part #:

1892813-1-ND

Manufacturer Part#:

1892813-1

Price: $ 19.83
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONNECTOR SOCKET STRAIGHT
More Detail: N/A
DataSheet: 1892813-1 datasheet1892813-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
108 +: $ 18.03250
Stock 1000Can Ship Immediately
$ 19.83
Specifications
Series: FLATPAQ, Elcon
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Receptacle, Female Blade Sockets and Male Pins
Connector Style: --
Number of Positions: 34
Number of Positions Loaded: All
Pitch: --
Number of Rows: 3
Number of Columns: --
Mounting Type: Through Hole
Termination: Solder
Contact Layout, Typical: 24 Signal, 10 Power
Features: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: --
Voltage Rating: --
Description

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Backplane Connectors – Specialized

Backplane connectors supplementing the main connector series of connectors, such as D-Sub series connectors, are termed specialized backplane connectors. Common examples include 1892813-1 modules for interconnections of backplane component strings, reducing excessive system noise by shielding, and determining signal ground and power ground connections. Since the number of pins is few and the data rate can be considerably high, the 1892813-1 requires a distinct design for proper successful implementation.

The 1892813-1 is purpose-designed and a specific application-oriented module meant for a backplane connection. It features 5 connectors, each having either two or three connections. The 1892813-1 is generally used in data communications systems with a capacitive signal coupling. It can also be used as a high-quality artificial connector suitable for a wide range of applications.

The 1892813-1 primarily functions as an interconnect between power and ground planes on a backplane hosting a processor or other peripherals. Secondary uses may include providing connections between general-purpose I/O pins and buses, when two boards are mated via any of a variety of connectors, and connecting between buses at the mother board level. There can be a bridge between the two planes due to the high capacitance of the 1892813-1 module.

The 1892813-1 module is made mostly of conductive rubber, and has components which help to connect two circuits at high frequencies. These components include gold-plated contacts, an elastomeric isolator, resistance grids, and polyethylene flex material. The module keeps signals clean and tight, while providing a means of bypassing the complexities of a main digital bus. The 1892813-1 housing ensures reliable contact retention, contact stability, and low current leakage.

It is these properties which make the 1892813-1 a suitable choice for backplane-based system designs; the robust rubber components offer excellent EMI filtering and high insulation performance, while the gold plating ensures reliable contact with other electronic components. Consequently, the 1892813-1 helps provide good signal integrity while minimizing power and signal losses. Furthermore, its tight design helps maintain spacing parameters for high-frequency applications.

The 1892813-1 connector module is usually integrated into a backplane system design when a high density connection is needed. It is a widely applicable choice for applications like microcontrollers, embedded controllers, optical systems, telecom systems, computers, communication systems, digital audio, video, and other kinds of circuitry.

In summary, the 1892813-1 is a specialized connector module designed for backplane applications, offering the user a wide range of advantages. It is a cost-efficient solution, delivering excellent impedance and power or signal isolation, as well as excellent noise envelopment.

The specific data is subject to PDF, and the above content is for reference

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