2-1542003-2

Series:	--
Part Status:	Active
Type:	--
Package Cooled:	BGA
Attachment Method:	Clip
Shape:	Cylindrical
Length:	--
Width:	--
Diameter:	1.375" (34.92mm) OD
Height Off Base (Height of Fin):	0.357" (9.07mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.20°C/W @ 200 LFM
Thermal Resistance @ Natural:	13.40°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Heat sinks are thermal systems used to dissipate large amounts of heat generated by electric components. While typically utilized in air or water cooled systems, discussions of their application in other thermal systems are also commonplace. A popular type of heat sink is the 2-1542003-2, used in a variety of industrial, commercial, and military applications. Heat sinks come in many different shapes and sizes, but typically share fundamental components and principles of operation. The 2-1542003-2, for example, utilizes an extruded aluminum frame with a special flat base design, bonded with a thermally conductive grease material. The extruded sections are designed to provide a number of fins, which come in different thicknesses and widths to create maximum surface area for efficient heat dissipation. The frame further contains multiple heat fins with pins or clips at the base for secure attachment. The shape of the fins is usually designed to maximize the area exposed to air and increase heat transfer from the component. This is done by directing air up through the fins, while at the same time absorbing and dissipating heat produced by the component. Because the heat generated by electronic components can vary greatly, the 2-1542003-2 is available in a variety of sizes and heat dissipation capabilities. Depending on the application, the size of the heat sink can be changed, with larger sizes able to dissipate greater amounts of heat. The increased size also allows for greater cooling efficiency. Although aluminum frames and fins are most commonly used for the 2-1542003-2, different materials can be utilized to further increase heat dissipation and thermal conductivity. These include copper, brass, and even stainless steel. Regardless of the material, the designs of the fins create turbulence and air velocity, which helps to increase the overall heatsink efficiency. In addition to the air cooled 2-1542003-2, liquid cooling systems are also available. The most popular of these is the pump and radiator system, which is frequently used in industrial and military applications. This type of system has several advantages, including greater cooling capacity, greater heat dissipation efficiency, and reduced noise. The 2-1542003-2 offers many advantages, and can be used in a variety of applications. With its customizable size, efficient heat transfer, and a variety of mounting options, it is no wonder why the 2-1542003-2 is a popular choice for many industries. As technology continues to progress, more efficient and effective methods of dissipating more heat in electronic components will continue to evolve. Technology aside, however, the 2-1542003-2 remains an important example of an effective thermal solution.

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