| Allicdata Part #: | 2-1542004-5-ND | 
                    
| Manufacturer Part#: | 
                                                            2-1542004-5 | 
                    
| Price: | $ 7.75 | 
| Product Category: | Fans, Thermal Management | 
                    
| Manufacturer: | TE Connectivity AMP Connectors | 
| Short Description: | HTS727-U=25MM HS ASSY ULTEM CL | 
| More Detail: | Heat Sink | 
| DataSheet: |  2-1542004-5 Datasheet/PDF | 
                    
| Quantity: | 1000 | 
| 350 +: | $ 6.97423 | 
| Series: | * | 
| Part Status: | Active | 
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are mechanical designs that work to keep electronic circuits and components cool during periods of intensive use, and they do so by redirecting heat away from them. 2-1542004-5, is one such example of a Thermal - Heat Sink that keeps heats away through the principles of conduction and convection. Conduction works by dissipating the heat away from the source by using a conductive material such as copper, aluminium, or any other materials with a high thermal conductivity. And the heat is then removed from the Heat Sink using a fan, or a liquid cooling system. This is how convection works to move the heat away from the circuit board and into the atmosphere where it can be dissipated.
The 2-1542004-5 Thermal - Heat Sink is composed of several components that work together to maintain its cooling efficiency and performance. First, it features fins made of aluminium, which are specifically designed to transfer the heat away from the component and spread it over a greater area, helping to reduce the peak temperatures. It also has a base plate, which is similar to the fin structure but made of a solid metal material for improved heat-distribution. Additionally, it has an integrated heat pipe, which helps to guide the heat away from the component through a process called heat spreading, resulting in a more efficient cooling performance.
The 2-1542004-5 Thermal - Heat Sink is designed to fit on most popular circuit boards, providing a reliable cooling platform. This heat sink is also easy to install, and its cooling performance can be increased by adding additional fins or adjusting the stack height. Furthermore, with its light weight and compact form factor, the 2-1542004-5 thermal- heat sink is perfect for applications where space is limited.
The 2-1542004-5 Thermal - Heat Sink is a great solution for applications that require effective cooling solutions, due to its reliable performance and easy installation. With its special fin design, heat can be transferred away from components quickly, thereby ensuring a safe and reliable operating environment. Additionally, those requiring high clock speeds or fast data processing can benefit from the heat sink’s effective cooling system since it will help to keep components from overheating, which could result in data loss, system downtime, and expensive repairs.
The specific data is subject to PDF, and the above content is for reference
            
    
2-1542004-5 Datasheet/PDF