| Allicdata Part #: | 2-1542006-2-ND |
| Manufacturer Part#: |
2-1542006-2 |
| Price: | $ 8.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | TE Connectivity AMP Connectors |
| Short Description: | HEAT SINK BGA 37.5MM 5FIN RADIAL |
| More Detail: | Heat Sink BGA Aluminum |
| DataSheet: |  2-1542006-2 Datasheet/PDF |
| Quantity: | 1000 |
| 250 +: | $ 7.36841 |
| Series: | -- |
| Part Status: | Active |
| Type: | -- |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Cylindrical |
| Length: | -- |
| Width: | -- |
| Diameter: | 1.375" (34.92mm) OD |
| Height Off Base (Height of Fin): | 0.678" (17.22mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 9.90°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
A heat sink is a thermal device designed to absorb and dissipate heat from heated electronic components or systems. Heat sinks are typically made of metals including aluminum, copper, and other alloys, and utilize specific surface treatments and designs to cool electronic components and systems. The 2-1542006-2 is a frame-style heat sink created for applications located on the printed circuit board (PCB).
Application Field
The 2-1542006-2 is designed to be used within various electronic equipment systems, due to its lower mass and design. The frame-style heat sink is created specifically to fit on a 2.4mm standard PCB, so its application can range from consumer electronics, communication technology, automotive technology, and other forms of technology requiring additional cooling. Since the 2-1542006-2 is designed to fit on a 2.4mm PCB, its application correlates to technology that requires the use of a standard 2.4mm PCB as its circuit board and needs additional cooling.
Work Principle
The 2-1542006-2 frame-style heat sink works in a similar manner to other heat sinks. It utilizes layers of metal to dissipate necessary heat to maintain a cooler operating temperature and provide cooling to electronic components on the board. The design of the 2-1542006-2 creates air channels between each layer of metal, which allow air to continually circulate and collect heat, dissipating hot air from the system or component. This air circulation causes turbulence, which enhances heat transfer and helps to reduce the operating temperature.
The heat produced by the electronic components is absorbed by the heat sink, and the hot air is then dispersed away from the electronic components. This helps maintains the cooler air flowing around the components, thus reducing the operating temperature. The heat sink provides additional cooling to the components, as well as dissipating any extra heat built up within the system, maintaining its overall functionality and effectiveness.
The 2-1542006-2 heat sink is designed to provide optimal cooling to maintain the temperature of electronic components on the board. Its design also helps to improve the thermal performance of the electronic systems and components, as well as providing extra protection and enhanced longevity to the electronic equipment.
Conclusion
The 2-1542006-2 heat sink is designed for applications that require the use of a 2.4mm PCB. Its design allows air to circulate between the layers of the heat sink, which helps to dissipate heat away from components on the board. The 2-1542006-2 is designed to provide optimal cooling for electronic components as well as providing extra protection and enhanced longevity for the electronic equipment.
The specific data is subject to PDF, and the above content is for reference