2-1542010-2 Allicdata Electronics
Allicdata Part #:

2-1542010-2-ND

Manufacturer Part#:

2-1542010-2

Price: $ 8.16
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 31MM HEATSINK ASSEMBLY.
More Detail: Heat Sink
DataSheet: 2-1542010-2 datasheet2-1542010-2 Datasheet/PDF
Quantity: 1000
315 +: $ 7.33824
Stock 1000Can Ship Immediately
$ 8.16
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks provide an effective way of transferring heat away from an electronic component, which can improve its performance, stability and elongate its usable life span. The 2-1542010-2 Heat Sink, originating from Shenzhen XTIMGLOBAL Corp., is a high temperature resistant flat package heat sink with a small thermal resistance and effective at preventing any temperature rises from occurring during the operation of equipment.

Application Field

The 2-1542010-2 Heat Sink is mainly used for cooling numerous modern day electronic devices. It is designed to match surface mount components and is also suitable for power dissipation tasks with reference to CPU and transistor. When applied correctly the heat sink can effectively reduce the operating temperature of electronic components, thus improving the product\'s life span as well as improving the quantity and safety of its output. There are currently many LED sources and LCD displays making use of the 2-1542010-2 Heat Sink.

Working Principle

The 2-1542010-2 Heat Sink is mainly composed of acrylic adhesive and aluminum material which work together to achieve the cooling performance. The heat is passed from the electronic component to the heat sink through its adhesive layer. The aluminum and heat sink are designed to have a high thermal conductivity coefficient, which allows them to quickly absorb and transfer the heat away from the electronic component. As a result the component temperature can be greatly reduced.

The acrylic adhesive layer used in the heat sink is thermally conductive as well as adhesive. By making use of this adhesive, users can easily attach the heat sink onto many different electronic components, such as CPUs and transistors. It is also able to provide a high durability attachment, which is capable of eliminating long term problems caused by vibrations or mechanical shocks.

The 2-1542010-2 Heat Sink provides an efficient and secure way of transferring heat away from electronic components. It is suitable for various types of optical, mechanical and electrical applications and is relatively flexible, allowing users to mount it to various components. By using this product consumers are able to stabilize the performance of their components as well as achieve a large expansion of its life span.

The specific data is subject to PDF, and the above content is for reference

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