| Allicdata Part #: | 2-1963554-7-ND |
| Manufacturer Part#: |
2-1963554-7 |
| Price: | $ 8.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | TE Connectivity AMP Connectors |
| Short Description: | 7 FINS, 2.000 OD HS W/4 LEGS, 27 |
| More Detail: | Heat Sink |
| DataSheet: | 2-1963554-7 Datasheet/PDF |
| Quantity: | 1000 |
| 260 +: | $ 7.90335 |
| Series: | * |
| Part Status: | Active |
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2-1963554-7 thermal-heat sinks are a type of heat sink devices that make use of the advanced technologies of thermal radiation to successfully transfer the produced heat away from an electronic device. By dissipating the heat, thermal-heat sinks are able to reduce the thermal resistance and prevent the device from overheating. Furthermore, they can reduce or eliminate the undesirable and often destructive effects that can be caused by excessive temperature increases in many electronic components.
The main application fields of thermal-heat sinks are in the fields of personal computers, mobile phones, servers, mainframes, and other equipment that generates and uses a large amount of energy. For example, computer processors are one of the hottest components inside a computer, as this is where the CPU\'s main calculations are happening. Without proper cooling, the component often suffers from thermal runaway as the heat accumulates. Thermal-heat sinks help prevent this by providing an excellent heat transfer mechanism. At the same time, they also help to reduce or eliminate the noise and vibrations that can be caused by the cooling fan or the conventional heat sink.
The working principle of thermal-heat sinks is based on the fact that by using an external heat source with radiative properties, the heat produced by an electronic device is transferred away from it easily. By using a combination of materials like aluminum and thermoelectric sheets with a wide temperature range, heat is conducted away from the device\'s circuits and out into the environment instead. In addition, the heat is also distributed evenly across the device’s surface for maximum cooling benefit.
The majority of thermal-heat sinks also feature printing technology in order to imprint different shapes onto their surfaces. This helps create a high thermal conductivity path, which not only makes heat transfer more efficient, but also allows the device to keep its shape unchanged, regardless of the mounting orientation.
The 2-1963554-7 thermal-heat sink features a long-term durability, as its performance does not degrade over time. Its performance is kept reliably cool, even under tough conditions that would usually lead to overheating. Furthermore, they feature both vertical and horizontal mounting options, allowing them to be used for a variety of applications.
Overall, the 2-1963554-7 thermal-heat sink is designed to provide a great solution for cooling down an electronic device without compromising its stability. By providing reliable heat transfer, this type of heat sinks prevents the device from overheating and preserves its durability for longer periods of time. Furthermore, their design makes them simpler to install and maintain.
The specific data is subject to PDF, and the above content is for reference
2-1963554-7 Datasheet/PDF