2-1963555-2 Allicdata Electronics
Allicdata Part #:

2-1963555-2-ND

Manufacturer Part#:

2-1963555-2

Price: $ 8.20
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 2 FINS, 2.000 OD HS W/3 LEGS, 27
More Detail: Heat Sink
DataSheet: 2-1963555-2 datasheet2-1963555-2 Datasheet/PDF
Quantity: 1000
250 +: $ 7.38157
Stock 1000Can Ship Immediately
$ 8.2
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks

2-1963555-2 Application Field and Working Principle

Heat sinks are devices used to cool components and maintain their temperature or improve its efficiency. They act as a buffer to reduce the thermal shock for components as well as make the need of complex, expensive, and heavy cooling systems obsolete. Heat sinks can be used to cool components ranging from small, like CPUs, to extra large, like power supply regulators.

The 2-1963555-2 heat sink is a good example of a device that provides thermal cooling. It is made of aluminum alloy and has a maximum temperature of 155°C (311°F), making it able to handle heat loads of more than 100W (0.1KW). It also has a fin pattern with a maximum surface area of 5.2 square inches (10cm2) and a thermal conductivity of 95W/m2°C.

The working principle of the 2-1963555-2 heat sink is based on the principle of heat conduction. When one end of the heat sink is heated, the heat is either released to the atmosphere or absorbed by the other end. The fin shape of the 2-1963555-2 heat sink provides it with a larger surface area, allowing it to dissipate more heat into the atmosphere. In addition, the aluminum alloy material provides a good thermal conductivity, enabling the heat to be transferred quickly from one end to the other.

The application field of the 2-1963555-2 heat sink is vast. It can be used for cooling components such as CPUs, GPUs, VGA cards, and hard drives. It is also suitable to be used in many industrial applications, such as manufacturing equipment, medical devices, and automotive electric components. Its high heat capacity and thermal conductivity make it suitable for use in many high-demand computing and industrial environments.

The 2-1963555-2 heat sink is a great example of a thermal cooling device. Its large surface area and high thermal conductivity provide effective cooling of components. Moreover, its wide application field allows it to be used in many industries, such as computing and manufacturing. All these factors combined make the 2-1963555-2 heat sink a great choice for a variety of cooling requirements.

The specific data is subject to PDF, and the above content is for reference

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