| Allicdata Part #: | 2-1963558-7-ND |
| Manufacturer Part#: |
2-1963558-7 |
| Price: | $ 9.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | TE Connectivity AMP Connectors |
| Short Description: | 7 FINS,2.000 OD HS W/4 LEGS,35MM |
| More Detail: | Heat Sink |
| DataSheet: | 2-1963558-7 Datasheet/PDF |
| Quantity: | 1000 |
| 250 +: | $ 8.99262 |
| Series: | * |
| Part Status: | Active |
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Thermal - Heat Sinks
2-1963558-7 Application Field and Working Principle
Thermal - Heat Sinks are passive heat exchangers, designed to physically or thermally dissipate heat into the environment. This is achieved by transferring thermal energy from a solid surface to an adjacent mass of air, liquid, or gas. Heat sinks use a combination of convection, conduction, radiation and fins to transfer the heat away from the surface.
2-1963558-7 is a specially designed heat sink that combines heat pipe technology and heat fin technology to provide superior thermal performance. They are designed to eliminate hot spots in high power boards by providing efficient heat dissipation.
The thermal performance of 2-1963558-7 is based on the combined thermal properties of both the heat pipe and the heat sink fin. The heat pipe provides superior thermal conductivity, while the heat fin increases surface area to maximize heat dissipation. The combination of these technologies reduces hot spots to a minimum.
In addition to providing efficient thermal management, 2-1963558-7 is also designed to be space-efficient and easily installed. The lightweight design of the heat sink allows for a minimal footprint while providing superior thermal performance. The heat pipes are designed to run along the height of the heat sink and are easily removable, allowing access to the underlying components for easy maintenance.
2-1963558-7 is designed for use in high power boards, where heat dissipation is critical. The high heat dissipation efficiency of the heat pipe, combined with the increased surface area provided by the heat fins ensures superior thermal performance. The combination of these technologies makes 2-1963558-7 an ideal choice for these applications.
In conclusion, 2-1963558-7 offers superior thermal performance and is an ideal choice for high power boards. The combination of heat pipe and heat fin technology ensures superior heat dissipation and a minimal footprint. The lightweight design of the heat sink also ensures easy installation and ease of maintenance.
The specific data is subject to PDF, and the above content is for reference
2-1963558-7 Datasheet/PDF