Allicdata Part #: | 2-1963560-2-ND |
Manufacturer Part#: |
2-1963560-2 |
Price: | $ 7.91 |
Product Category: | Fans, Thermal Management |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | 2 FINS,2.000 OD HS W/4 LEGS,37.5 |
More Detail: | Heat Sink |
DataSheet: | 2-1963560-2 Datasheet/PDF |
Quantity: | 1000 |
250 +: | $ 7.12054 |
Series: | * |
Part Status: | Active |
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Thermal-Heat Sinks are an integral part of modern electronics technology. The 2-1963560-2 is a type of Thermal-Heat Sink that is designed for powerful electronic components, such as central processing units (CPUs), semiconductors, and other devices. The 2-1963560-2 is an effective solution for dissipating generated heat, thereby preventing the components from burning out. In this article, we will discuss the application field and working principle of the 2-1963560-2 Thermal-Heat Sink.First of all, the 2-1963560-2 Thermal-Heat Sink is mainly used in computers and other electronic devices that generate a lot of heat. It is highly efficient at dissipating heat, which makes it ideal for overclocking and preventing components from burning out due to overheating. Other application fields of the 2-1963560-2 Thermal-Heat Sink include gaming consoles, graphic cards, and other electronic devices that produce considerable amounts of heat.The 2-1963560-2 Thermal-Heat Sink works on the principle of convective air cooling. This means that the air is moved around the device, usually with the help of a fan, so that cool air is circulated around the electronic component. This helps to absorb the heat generated by the electronic component and dissipate it to the surrounding air. The fan also increases the cooling efficiency by preventing hot air from being trapped in the device.The 2-1963560-2 Thermal-Heat Sink is made up of a number of small fins that are arranged in a radial pattern. These fins are designed to increase the surface area available for heat transfer, so that more of the generated heat can be dissipated. The air passes through the fins of the sink and absorbs the heat before being expelled from the device. In addition to this, the 2-1963560-2 Thermal-Heat Sink is designed to be highly efficient at dissipating heat, so that the electronic components do not overheat.Another benefit of using the 2-1963560-2 Thermal-Heat Sink is that it is highly efficient at directing airflow over the device. This means that the air is able to reach all corners of the component, so that the generated heat can be dissipated evenly. In addition to this, the sink is also designed to be lightweight, so that it can be easily fitted to the component without increasing the overall weight.All in all, the 2-1963560-2 Thermal-Heat Sink is a highly effective cooling device for computers and other electronic devices that generate a lot of heat. It works on the principle of convective air cooling, which helps to absorb and dissipate the heat generated by the device. In addition, it is designed to be lightweight and highly efficient at directing airflow over the device, so that the entire surface area of the component is cooled evenly.
The specific data is subject to PDF, and the above content is for reference