2-1963564-2 Allicdata Electronics
Allicdata Part #:

2-1963564-2-ND

Manufacturer Part#:

2-1963564-2

Price: $ 8.11
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: 2 FINS,2.000 OD HS W/3 LEGS,2
More Detail: Heat Sink
DataSheet: 2-1963564-2 datasheet2-1963564-2 Datasheet/PDF
Quantity: 1000
250 +: $ 7.29701
Stock 1000Can Ship Immediately
$ 8.11
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks are used for a wide range of applications. 2-1963564-2 Heat Sinks are designed to provide the highest performance in heat dissipation. They are perfect for use in high performance applications, such as GPUs, CPUs, and other high-power applications that require extreme thermal dissipation.

The principle behind the 2-1963564-2 Heat Sink is based on the heat sink\'s ability to absorb heat from the device or machine to which it has been attached. Heat from the device or machine is dissipated through an array of fins, which act as a radiator. The fins are optimally designed to maximize their surface area, which increases their thermal conductivity. The fins also help to divert heat away from the device or machine.

A heat sink typically has a heatsink base, made of a material with excellent heat transfer capabilities, and a series of thermally conductive aluminum fins. The base is generally made of copper due to its excellent thermal properties, while the fins may be made of aluminum, stainless steel, or other materials with high heat conductivity. The base of the heatsink is attached directly to the device or machine, and then the fins are placed on top of the base.

The fins act as an efficient way of dissipating heat from the device or machine, as they provide the thermal conductivity that enables the cool air to circulate around the fins and then be expelled outwards. This increases the rate at which the heat is dissipated, and thus, keeps the device or machine cool.

Heat sinks are designed to be able to work in a variety of temperatures. This allows them to be used in a range of applications, from low-performance computers with intensive processor use, to high-performance machines that require extreme temperature control. Depending on the application, a heat sink may be designed for a specific temperature range. For example, a high-performance heat sink may have a thermal resistance that can handle temperatures up to 200°C.

2-1963564-2 Heat Sinks provide excellent thermal performance and are perfect for a wide range of applications. They provide high-performance cooling and are ideal for applications that require superior thermal management. It is important to choose the right size and design of heat sink for the application at hand, to make sure that it is capable of dissipating the heat in an efficient manner.

The specific data is subject to PDF, and the above content is for reference

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