2069838-1 Allicdata Electronics

2069838-1 Connectors, Interconnects

Allicdata Part #:

2069838-1-ND

Manufacturer Part#:

2069838-1

Price: $ 8.41
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SCKT BACKPLATE FOR LGA1156
More Detail: Connector Backplate and Lever Kit For LGA 115X Con...
DataSheet: 2069838-1 datasheet2069838-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
200 +: $ 7.64505
Stock 1000Can Ship Immediately
$ 8.41
Specifications
Series: --
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Accessory Type: Backplate and Lever Kit
For Use With/Related Products: LGA 115X Connectors
Body Material: Steel
Body Finish: Zinc
Color: Silver
Features: --
Material Flammability Rating: --
Operating Temperature: --
Description

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Sockets for ICs, Transistors - Accessories

One of the biggest challenges with ICs, transistors, and other electronic components is the risk of damage from rework or thermal cycling. With multiple packages now available, manufacturers are using a variety of techniques to protect their components. One of these techniques is the use of sockets for ICs, transistors and other components. Socketing ICs, transistors and other components allows for a degree of protection and long-term reliability.

The 2069838-1 Socket is a top-mounted socket specifically designed for ICs, transistors, and other electronic components. The 2069838-1 is available in both single- and double-socket configurations. The double-socket configuration is for when two components are needed in the same area. This socket is designed to fit most packages such as DPAK, DIP, and SOIC packages. Additionally, the 2069838-1 can accommodate standard PLCC packages.

The 2069838-1 Socket has a unique feature that uses a two-piece construction, which provides easier access to devices. This two-piece construction also provides superior surface contact for improved thermal transfer and allows for variable depths, giving you more installation flexibility. The 2069838-1 Socket also has a integral EMI/RFI protection feature that helps protect the socket and any electronics connected to it from electromagnetic interference.

The 2069838-1 Socket also offers superior solderability and is available in lead-free versions. The gold lead post make sure for maximum electrical performance and superior solderability. The socket also offers a low insertion force and high pull-out force, thus minimizing risk of damage to sensitive components.

The 2069838-1 Socket is designed to be used with small ICs, transistors and other components, and is particularly suitable for use in harsh environments. The socket provides superior protection against damage due to shock, vibration, humidity, and other environmental conditions. This socket also has a high temperature capability, making it ideal for many applications. It is also resistant to static electricity build-up, making it perfect for use in applications with frequent rework.

The 2069838-1 application field and working principle is simple, but effective. To install a component, the pin of the component is inserted into the hole of the socket and then be soldered using a soldering iron. The socket then create a continuous connection between the device and the printed circuit board. Contact pressures are automatically adjusted according to the size of the component, thus providing a secure electrical connection. The socket also provides a layer of insulation between the component and the circuit board, which protects the board from short circuits caused by static discharge.

The 2069838-1 Socket is an effective way to improve the reliability and increase the life of components. The socket can also provide protection against mechanical shock and environmental hazards such as moisture, dust, or extreme temperatures. The 2069838-1 Socket is also an affordable way to protect components from damage caused by rework, thermal cycling, and EMI/RFI pollution.

The specific data is subject to PDF, and the above content is for reference

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