208262-3

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Backplane Connectors - Contacts

The 208262-3 is a backplane connector with high density contacts. These connectors were developed to meet the industry\'s need for higher speed networks in computing and communication applications. This connector is targeted for two markets: data high-speed backplane and embedded high-speed applications.

The 208262-3 is an integral part of the openStackIQ (OSIQ) family of products. It is a enhanced evolution of backplane connectors that meets the most stringent requirements for reliable and consistent backplane networks. It has the ability to use high-speed signal integrity components, such as differential pairs, to ensure high-speed data communication.

Design and Features

The 20826-3 was designed with a stacked two-piece housing for superior shielding of the contacts. The contacts are positioned in a staggered layout within the connector housings which provides enhanced interference suppression and prevent cross talk. The contacts are Zero Force Insertion (ZIF) type and the design allows for increased I/O density and lower insertion force. The connectors are also RoHS compliant.

The 208262-3 offers a wide array of features such as four differential pairs per contact, 50 ohm vias, 2-level shielding, high-speed electrical performance up to 12.5 Gbps, and numerous plating options. The openStackIQ connectors are also available in various shapes, sizes, and configurations.

Working Principle

The 208262-3 connector works by transferring electrical signals through the contacts. As power is transferred, the contacts react and the electrical field changes shape, storing and containing the energy. This electrical energy is then relayed to the male and female connectors on either side. As the male and female connectors are connected, the energy is transferred between them and then to the device. This energy is then processed by the device to establish a connection between the two. The 208262-3 is designed to ensure optimal signal transfer between the two, allowing for high speed and reliability.

Application Fields

The 208262-3 is a high speed, low profile, and reliable backplane connector. As such, it is applicable in various high speed data communications applications such as servers, switches, routers, and storage devices. It can also be used in embedded applications such as in mobile phones, tablets, and other small portable devices. Additionally, it is suitable for industrial applications such as automotive, industrial automation, and medical, as well as telecom applications.

Overall, the 208262-3 is a reliable and cost effective backplane connector for high speed data communications applications. It is designed for superior signal integrity and offers a high degree of depth as well as I/O density. With a wide array of features, plating options, and enhanced shielding, it is suitable for numerous applications and provides reliable and consistent backplane networks.

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