2110926-1

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are increasingly being used in the 2110926-1 application field. They can be manufactured from a variety of materials including metal, ceramic, or semiconductor dielectric materials, depending on the application requirements. Heat sinks can be used for cooling many different types of electronics, such as computer CPUs, power semiconductors, RF transistors, laser diodes, and optical fibers. Their purpose is to absorb and dissipate heat generated from components being operated at higher-than-normal temperatures.

Heat sinks are used to help reduce the working temperature of a component through thermal conduction. Heat sinks use a combination of physical contact between a heat-generating device and a cooling medium (usually air or liquid), as well as thermal radiation from the heat-generating device to transfer heat away from the device and into the cooling medium, thus helping to maintain safe operating temperatures within a device. Heat sinks are classified as either passive or active. Passive heat sinks are non-mechanical and rely on thermal convection to carry away heat. Active heat sinks use a forced airflow, typically from a fan or other active cooling device, to help remove heat. They are usually more effective than passive heat sinks when cooling higher power devices.

In its most basic form, a heat sink consists of a metal sheet that conducts heat away from the heat-generating device. To further optimize its thermal performance, grooves or fins can be added to increase the surface area of the heat sink. Heat dissipation is further improved by shape optimization, thermal radiation, and forced convection. To further improve air flow and cooling, a fan or other active cooling device may be mounted on top of the heat sink.

Heat sinks can also be manufactured from heat-conductive materials with low thermal impedance through enhanced thermodynamics in order to improve the heat dissipation of the device. Through this technique, more of the heat generated by an operating device can be removed effectively, thus reducing the amount of cooling that needs to be provided. Heat sinks of this type are commonly used in higher power applications, such as in the cooling of high performance video cards, processors, and CPUs.

Heat sinks are also used to provide electromagnetic interference (EMI) shielding. Heat sinks of this type shield electronic circuits from electrical and magnetic fields, making them ideal for use in environments where sources of EMI are present or when components need to be shielded from other sources of EMI. Heat sinks that use conductive shielding materials such as copper or aluminum are most effective for providing EMI shielding. Heat sinks made of thermally conductive materials are also used for EMI shielding since they can help reduce the heat generated by the device, making it less susceptible to interference from other sources.

Heat sinks are used in a variety of application fields, including portable and consumer electronics, automotive, industrial and medical applications. In general, they are used to help keep operating temperatures within safe limits. Their efficient use of thermal principles, convenience and relative low cost make them an ideal solution for many applications.

The specific data is subject to PDF, and the above content is for reference