2132464-1

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Backplane connectors provide a structured connection between the backplane and the daughter card, forming a "mother-daughter" relationship. The 2132464-1 is a backplane connector with a specialized application field and working principle.

Overall, 2132464-1 connectors are typically used as backplane connectors for communication systems in high frequency with frequency up to 40Ghz. Furthermore, the connector is also widely used in high-speed backplanes, with speeds up to 67Gbps. It is mainly used in communication systems such as 5G base station, cloud computing, data center and other fields.

The 2132464-1 connector is made with high temperature resins with high flowability and adhesion properties. This ensures the insulation performance of the connector in high temperature environments. Since the connector is made with a die-die material, it has an extremely small precision and a high tolerance of transmission loss. It also has strong anti-vibration and anti-interference capability. In addition, the connector has a self-locking structure, which can strongly hold the connection and still operate reliably even in extreme environmental conditions.

The working principle of the 2132464-1 connector is based on the principle of reducing resistance. The connector is designed so that its contacting surface has a uniform distribution of stress and low contact resistance which helps reduce the transmission loss. In addition, the connector also has a low impedance design which improves signal transmission and crosstalk performance.

The 2132464-1 connector also has an integrated ground layer, which ensures the electrical grounding of the contact pins. This helps maintain signal quality and reduce signal noise. Furthermore, the connector has an insertion depth of 0.3 mm, which minimizes insertion loss and ensures excellent signal transmission performance.

In conclusion, the 2132464-1 backplane connector is a specialized type of connector with excellent mechanical and electrical properties. It is designed for high frequency communication systems, and has a low resistance design for signal transmission and crosstalk performance, as well as an integrated ground layer. It also has a self-locking structure for strong connection and reliable operation in extreme conditions.

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