2170488-6

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks (sometimes also referred to as "heat spreaders" or "heat pipes") are a type of heat transfer device that uses the principles of fluid dynamics and thermodynamics to dissipate heat away from an electronic component. Thermal heat sinks are commonly used in computers as well as other electronic devices to draw heat away from working components. In the case of a personal computer, the CPU, graphics card, and other power-intensive components may have heat sinks mounted on them to prevent overheating.

The 2170488-6 application field is focused on cooling efficiently and quickly dissipating high heat levels in order to avoid overheating and thermal degradation. This thermal heat sink’s working principle is based on the concept of convection, which is the transfer of heat between an object and its environment due to the movement of fluid particles. The heat is moved from the heated components of a device to a heat sink, which is cooler and has larger directional surface area than the component, resulting in more efficient heat dissipation.

Typically, this type of thermal heat sink consists of an aluminum casing sitting atop a thermally conductive base. Heat is then drawn away from the heated component through the base, and the casing works to distribute the heat more evenly. These heat sinks also feature sets of fins, also known as “riffles”, which are designed to increase the surface area to facilitate more effective dissipation. The fins further act to provide more direction to the flow of hot air, which increases convection and leads to faster heat transfer.

The effectiveness of 2170488-6 thermal heat sinks is also improved by ensuring that the air being moved by the fins is greater than the standard air density in the surrounding area. An axial fan is usually in place with this type of heat sink to increase the air velocity and pressure above the average values as heat is moved away from the device. The increased velocity and pressure will then enable greater heat transfer from the component.

The cooling performance of 2170488-6, as with most other thermal heat sinks, can be further optimized by utilizing a heat conductive paste or a thermal pad applied on the interface between the component and the heat sink. This paste or pad will fill any air gaps between the two components, as well as improve the contact between them, thus resulting in even more efficient heat transfer.

In conclusion, the 2170488-6 thermal heat sink is an efficient and reliable heat transfer device specially designed for dissipating high levels of heat quickly, thereby allowing electronic components to operate safely and uninterruptedly. It utilizes the principles of fluid dynamics and thermodynamics, along with a combination of an aluminum casing, thermally conductive base, and a set of fins, to transfer heat away from the components and protect them from damage caused by overheating.

The specific data is subject to PDF, and the above content is for reference