| Allicdata Part #: | 345-1474-ND |
| Manufacturer Part#: |
219-263A |
| Price: | $ 1.53 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | TO-263 HEAT SINK ANODZD |
| More Detail: | Heat Sink TO-263 (D²Pak) Aluminum 2.0W @ 30°C Top ... |
| DataSheet: |  219-263A Datasheet/PDF |
| Quantity: | 747 |
| 1 +: | $ 1.39230 |
| 10 +: | $ 1.35387 |
| 25 +: | $ 1.31720 |
| 50 +: | $ 1.24400 |
| 100 +: | $ 1.17079 |
| 250 +: | $ 1.09761 |
| 500 +: | $ 1.06103 |
| 1000 +: | $ 0.95127 |
| 5000 +: | $ 0.93297 |
| Series: | 219 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-263 (D²Pak) |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 1.020" (25.91mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.480" (12.19mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 30°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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219-263A Thermal - Heat Sinks
The 219-263A Thermal - Heat Sinks device is used to dissipate excess heat from electronics components. The device itself consists of a heat sink which is a heat dissipating device attached to an electronics component, either in the form of a solid metal block or a thin sheet of metal attached to the component. Heat sinks are designed to conduct heat away from the device or component and also reduce the operating temperature of the device.
Applications of the 219-263A Thermal - Heat Sinks
The 219-263A thermal - heat sink device is used in applications where heat needs to be dissipated away from electronic components such as transistors, integrated circuits, voltage regulators, memory chips and graphics processors. The device is also suitable for use in power amplifiers, TV tuners, laptop computers, notebook computers, game consoles, and embedded systems as well as in commercial products such as light fixtures, air-conditioners and automobiles.
Working Principle of the 219-263A Thermal - Heat Sinks
The 219-263A thermal - heat sink device works on the principle of thermodynamics. The device absorbs heat from the component and dissipates it to the surrounding environment. This is done through a process known as convection, whereby heat is transferred from the hot component to the cold environment through the thermal conductor. In other words, the heat is transferred from the component to the heat sink and then to the surrounding environment.
The heat sink works to reduce the temperature of the device to within safe operating temperatures by either absorbing and dissipating the heat, or by cooling the device directly. This is known as direct cooling, where the heat dissipated from the device is transferred directly to the surrounding environment. In this method, the heat sink is cooled by either forced air cooling or liquid cooling.
Conclusion
The 219-263A thermal - heat sink is an effective and efficient way to dissipate heat from electronic components. It is used in various applications and is designed to reduce the operating temperature of components while keeping them safe from damage caused by high temperatures. Its effective working principle makes it a popular choice for many applications.
The specific data is subject to PDF, and the above content is for reference