Allicdata Part #: | 222190-3-ND |
Manufacturer Part#: |
222190-3 |
Price: | $ 90.20 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | PIN,TRIAXIAL,SIZE 8,ARINC |
More Detail: | Contact Gold Coaxial Pin, Center M17-176-00002, No... |
DataSheet: | 222190-3 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
100 +: | $ 81.99450 |
Series: | ARINC |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Type: | Coaxial |
Pin or Socket: | Pin, Center |
Contact Termination: | Crimp |
Wire Gauge: | M17-176-00002, Northrop 05A0578-1 |
Contact Finish: | Gold |
Contact Finish Thickness: | 50.0µin (1.27µm) |
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Backplane connectors have become a vital part of modern electronic systems. They are used in a variety of applications and come in a number of types, each specialized for specific applications. One of the more common types is the 222190-3 backplane contact. These contacts are commonly found in home and small office network devices such as DVRs, set-top boxes and routers.
A 222190-3 backplane contact is a type of pin connector designed to bridge the gap between a single board computer and another PCB. It is primarily used in high speed data transfer applications where the contact needs to carry a significant amount of current or voltage. The contact is rated for 2.0A and has a life expectancy of between 1 and 4 million operations. It has a standard profile that allows it to be mounted in any standard backplane connector system.
The 222190-3 backplane contact is a robust connector featuring dual beam contacts that ensure a reliable connection. The dual beam contact enables the contact to stay in place and ensure a reliable and secure connection even under heavy vibration or shock. They are also designed to remain in place during installation, preventing potential damage from improper assembly. The contact is available in two varieties, one with an integrated strain relief which prevents it from being pulled out of the backplane and another that does not.
The contact also provides a low resistance, allowing it to transfer data quickly and efficiently while avoiding signal loss. This makes it a great choice for applications where high speed data transmission is required. The 222190-3 contact is also designed to be used in high-density applications, where it can be added to densely-packed systems to increase system density and reduce overall component count.
The 222190-3 contact is designed to be used in a variety of ways. It is often used to provide power and ground connections between an array of boards in a multi-board system. It is also commonly used in bridge applications, where it is used to bridge the gap between a processor board and another board in the system. It is also often found in embedded systems where it is used to connect various system components including digital I/O lines, analog sensors, video signals, and audio lines.
The 222190-3 contact has a number of unique qualities that make it a popular choice for a variety of applications. First, the contact is designed to hold up in the most extreme environments. The contact features high durability and can withstand high shock and vibration as well as extreme temperatures. Second, the contact’s properties make it ideal for high-speed data transfer applications. Lastly, its low-resistance properties make it perfect for providing efficient solutions for high-density applications.
The 222190-3 contact is a reliable and robust choice for a variety of applications. Its dual beam design, robust construction, and low-resistance characteristics make it a great choice for high-speed data transmission and for providing reliable connections in high-density applications. The contact is designed to be used in the most extreme environments and can withstand a large amount of shock and vibration as well as extreme temperatures.
The specific data is subject to PDF, and the above content is for reference
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