223532-1

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

223532-1 backplane connectors, otherwise known as C-Grid III connectors, are a combination of connectors and interconnects with a few distinct features. This type of connector is specialized for data transmission and interconnection between boards in high-end computer systems. It ensures high-performance data transmission both for real-time data and high-speed signals.

Application Field

223532-1 backplane connectors are mainly used in high-end computer systems for increased signal integrity, such as direct connect systems allowing high-speed data transfer and cascading for multilayer applications. In addition, this type of connector is used in low-power applications, such as internal high-definition audio/video systems.

This connector is ideal for applications where extreme board stacking is desired to reduce the volume of the system. This connector is suitable for applications that require power distribution, data transmission, and usages with a limited number of power supplies. In addition, 223532-1 can be used to adapt multiple host bus technologies, such as PCIe, PCI, or Gigabit Ethernet.

Working Principle

223532-1 backplane connectors are based on a modular approach. The connector is made of insulated pins and receptacles that are plugged into a board-level connector. These pins and receptacles are organized into two levels, the signal pins, and the power pins. The signal pins are used to provide the data transmission and the power pins are used to provide the power connection. The combination of pins and receptacles is arranged to ensure the proper connection between the active and passive components.

The connector has a pin-and-socket design that ensures all power and data connections are maintained even after repeated insertions and removals. It also provides very low insertion and removal force, allowing for easy and reliable assembly. The power pins are gold plated to provide optimal electrical contact, and the signal pins are plated with tin-lead for enhanced solderability.

The connector has a small surface area which is ideal for space-constraint applications. It also has a high-speed capability, which is important for high data rate transmission. Additionally, the connector is designed to reduce crosstalk between the power pins and the signal pins. This can be achieved through a combination of contact, shielding, and support element design. The shielding elements also protect the connector from EMI/RFI interference.

All these features make 223532-1 backplane connectors an efficient and reliable connection between boards in high-end computer systems. The combination of small size, low cost, and high performance of the connector make it the best choice for many applications.

The specific data is subject to PDF, and the above content is for reference