2286211-3 RF/IF and RFID

Series:	--
Part Status:	Active
Type:	Shield Finger, Pre-Loaded
Shape:	--
Width:	0.067" (1.70mm)
Length:	0.157" (4.00mm)
Height:	0.094" (2.40mm)
Material:	Copper Alloy
Plating:	Gold
Plating - Thickness:	19.685µin (0.50µm)
Attachment Method:	Solder
Operating Temperature:	--

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RFI and EMI - Contacts, Fingerstock and GasketsRadio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are two of the most common electromagnetic interference sources encountered in electronic systems. It is important for engineers to understand how these signals can be attenuated, controlled, and re-routed at the component level in order to provide adequate protection against their effects. The application of contact materials to shield electronics from RFI and EMI is an important topic for many industries, and 2286211-3 is a product specifically designed to combat interference.2286211-3 is a contact material designed to provide an effective interface between two circuit boards to protect against RFI/ EMI. This material is composed of a high purity copper sheet laminate with a high-performing elastomeric sheet affixed to each side. It is designed to provide mechanical and electrical connections between circuit board layers and grounding points to offer superior RFI/EMI protection.The working principle of 2286211-3 can be divided into three different levels. At the first level, 2286211-3 contact material helps to protect the PCB from being damaged or interfered by external EMI noise. The high purity copper sheet, which is the core layer of the contact material, provides excellent electrical connectivity and mechanical support for the board. The copper is laminated with the elastomeric sheet on either side which acts as an electrical insulation barrier, thus isolating the board from external interference. This allows the PCB to maintain optimal signal integrity and provide superior performance.At the second level, 2286211-3 contact material is applied to serve as a low-impedance EMI/RFI filtering solution. The sheet includes a conductive core which helps to reduce the impedance of the signal traced on the surface, so that unwanted EMI/RFI signals are effectively blocked and isolated. The elastomeric sheets also serve as a dielectric medium, allowing only those frequencies within their range to pass through.The third level of protection provided by 2286211-3 contact material is achieved by its fingerstock feature. This feature provides an additional layer of insulation between the PC board and the elastomeric sheet, ensuring greater signal integrity and better protection from EMI/RFI noise. The contact material itself is a combination of a high purity copper sheet laminated with elastomeric sheets onboth sides, and the fingerstock feature provides improved consistency during manufacturing processes.In addition to its contact material, 2286211-3 also includes gaskets specifically designed for application in EMI/RFI shielded systems. The main purpose of the gaskets is to provide good mechanical attachment between the board and various components, while also shielding them from external EMI/RFI noise. This shielding is achieved through the use of EMI shielding gaskets, which are designed to fit tightly around the component and the board and reduce the chances of EMI/RFI leakage or interference.In conclusion, 2286211-3 is a contact material which provides an effective interface for two coupled circuit boards and offers superior RFI/EMI protection. Its core layer of high-purity copper provides excellent electrical connectivity and mechanical support, and its elastomeric sheets provide a dielectric medium to block external interference. Its fingerstock feature adds to the shielding effect, and the accompanying gaskets further protect the board from EMI/RFI noise.

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