| Allicdata Part #: | 345-1127-ND |
| Manufacturer Part#: |
233-60AB-10E |
| Price: | $ 0.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK TO-220 VERT BLK W/TABS |
| More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 58°C Board Level,... |
| DataSheet: |  233-60AB-10E Datasheet/PDF |
| Quantity: | 1000 |
| 12000 +: | $ 0.19025 |
| Series: | 233 |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 0.725" (18.42mm) |
| Width: | 0.570" (14.47mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 58°C |
| Thermal Resistance @ Forced Air Flow: | 11.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks, along with other cooling components like fans, are an integral part of any electronic system. The 233-60AB-10E heat sink is no exception — its application field and working principle are vitally important for the efficient operation of the system.
The 233-60AB-10E offers superior thermal performance in electronic systems to protect components and increase the expected lifespan of components within the system. It is especially useful in areas with a lot of high-frequency components, which can generate significant amounts of heat. In these cases, the 233-60AB-10E can quickly and effectively dissipate heat.
The heat sink consists of a metal block of approximately 30 cm² in surface area. This block is composed of dozens of fin-shaped protrusions that protrude from the block, allowing for the quick exchange of thermal energy with the air; this block also provides a large area for the heat to be dissipated from the processor. The whole assembly is then affixed to a steel plate, with clips or mounting screws included, to provide additional strength and stability.
The 233-60AB-10E operates in much the same way as any other heat sink. It uses convection cooling, which is the transfer of heat from the component to the surrounding environment. As the air in the environment is cooler than the component, the thermal energy is exchanged as the air passes over the heat sink. This increased flow of heat away from the processor allows the processor to remain cooler, more efficient, and safer from thermal damage.
The 233-60AB-10E can be used in different applications, ranging from consumer electronics to automotive systems. It is particularly effective as a cooling device for microprocessors, as its increased surface area increases its ability to quickly dissipate heat from the processor. This improved cooling performance also helps to extend the life of the processor and makes it more reliable.
The 233-60AB-10E heat sink is an effective and reliable solution for the cooling of components in electronic systems. Its large surface area and effective use of convection cooling make it an ideal choice for microprocessors and other high-frequency devices, as the enhanced cooling performance helps to extend the life and reliability of the processor. It is also versatile enough to be used in many different applications, making it an ideal choice for your cooling needs.
The specific data is subject to PDF, and the above content is for reference