Allicdata Part #: | 345-1014-ND |
Manufacturer Part#: |
233-60AB |
Price: | $ 0.20 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK TO-220 VERT/HORZ BLK |
More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 58°C Board Level |
DataSheet: | 233-60AB Datasheet/PDF |
Quantity: | 1000 |
4000 +: | $ 0.17530 |
Series: | 233 |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 0.600" (15.24mm) |
Width: | 0.570" (14.47mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 2.0W @ 58°C |
Thermal Resistance @ Forced Air Flow: | 11.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 29.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Heat Sinks are used as a dissipation mechanism for thermal energy in a variety of applications. Thermal energy is energy that is transferred from one material to another as a result of a difference in temperature. By providing a means of dissipation for thermal energy, heat sinks can help regulate and maintain the temperature of a device or component to prevent damage or overheating. The 233-60AB is a heat sink designed to provide a secure and efficient cooling solution for high powered applications.
The 233-60AB is a compact, lightweight heat sink designed for a wide range of applications. It is made from a thick die cast aluminum alloy that is lightweight yet strong. This material has a high thermal conductivity rating that helps to dissipate thermal energy quickly and efficiently and is designed to withstand temperatures up to 200°C (392°F).
The design of the 233-60AB features a number of thermally-optimized fins that help to spread the thermal energy across the entire surface area of the heat sink, helping to dissipate heat faster than linear designs. In addition to the fins, the 233-60AB also features a unique air flow system that helps to optimize the amount of air that passes through the heat sink, helping to further improve its cooling capabilities. This air flow system is designed to help maintain a consistent temperature and to prevent the risk of overheating.
The 233-60AB can be used in a variety of applications, including computer cooling, power supplies, LED light fixtures, and other electronics. It is especially well-suited for high-powered applications where a high level of cooling is required. The heat sink is designed to provide a secure and efficient cooling solution, helping to optimize device performance and extend their lifespan.
The working principle behind the 233-60AB heat sink is simple. The heat generated by the device or component is absorbed by the fins of the heat sink, and is then dissipated into the surrounding air. The thermally-optimized fins help to spread the thermal energy over the entire surface area of the heat sink, and the unique air flow system helps to further improve its cooling capabilities. The heat sink helps to regulate the temperature of the device or component, helping to prevent any unnecessary heat or damage.
The 233-60AB is an effective and reliable heat sink solution, offering efficient and secure cooling for a variety of applications. Its thermally-optimized design helps to spread the thermal energy quickly and evenly, and its unique air flow system helps to optimize its cooling capabilities. By providing a secure and efficient cooling solution, the heat sink helps to ensure that devices and components remain cool and protected during operation.
The specific data is subject to PDF, and the above content is for reference