| Allicdata Part #: | 240-118ABH-22-ND |
| Manufacturer Part#: |
240-118ABH-22 |
| Price: | $ 0.29 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK TO-220 VERT TWIST FIN |
| More Detail: | Heat Sink TO-220 Aluminum 4.0W @ 55°C Board Level,... |
| DataSheet: |  240-118ABH-22 Datasheet/PDF |
| Quantity: | 1000 |
| 5600 +: | $ 0.26725 |
| Series: | 240 |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and Clip |
| Shape: | Rectangular, Fins |
| Length: | 1.180" (29.97mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 4.0W @ 55°C |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | 13.80°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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240-118ABH-22 thermal - heat sinks have many applications and play a pivotal role in many electronic systems as it helps to dissipate heat away from sensitive components, allowing the device to function optimally. The heat sink is commonly constructed from aluminum and has two main functions: the extraction of heat from the component or area to which it is attached and the dissipation of that same heat to the outside of the device.
Heat sinks are used in devices such as computers, laser printers, amplifiers, projectors, and medical equipment. By attaching the heat sink to a component or area of a device that generates a lot of heat, the heat sink captures heat in the form of thermal energy. It then transfers this heat to a larger area on the device where it can be dissipated more easily. As the heat is transferred away from the device, it helps to improve the overall performance and efficiency of the system.
In the case of the240-118ABH-22 numerous fins are used to increase surface area. Heat is drawn away from the device’s components and transferred to these fins, where it can then be released into the ambient air. This heat removal process allows the temperature of the device’s internal components to stay within a safe operating limit. The fins can be arranged in varying heights and shapes to maximize the efficiency of the heat transfer.
The second main purpose of the240-118ABH-22 is to direct the airflow onto the device’s components. By directing the airflow, more heat can be drawn away from the components. Air is directed downward and outward by the arrangement of heatsink fins, which helps to regulate the temperature of the components. This ensures that there is always enough airflow to provide adequate cooling and prevent the components from overheating.
In addition,240-118ABH-22 have a specialized coating that helps to reduce the amount of thermal radiation that is produced. This helps to reduce the amount of heat that is transferred from the device and to the surrounding environment. This coating is made of a high-performance material such as copper, aluminum, or anodized aluminum, and is applied to the heatsink to provide an extra layer of protection.
240-118ABH-22 thermal - heat sinks are highly effective at pulling heat away from the components it is connected to and dissipating it efficiently. This helps to maintain proper operating temperatures and improve the lifespan of the device. Furthermore, the specialized coating on the heatsink helps protect the device from additional thermal radiation, allowing it to operate at optimal levels for a longer period of time. With the help of this technology, devices that require a high degree of cooling can be better equipped to handle the demands of high-performance computing.
The specific data is subject to PDF, and the above content is for reference