242-125ABE-22 Allicdata Electronics
Allicdata Part #:

242-125ABE-22-ND

Manufacturer Part#:

242-125ABE-22

Price: $ 0.27
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK TO-220 LOW PROFILE
More Detail: Heat Sink
DataSheet: 242-125ABE-22 datasheet242-125ABE-22 Datasheet/PDF
Quantity: 1000
4000 +: $ 0.23989
Stock 1000Can Ship Immediately
$ 0.27
Specifications
Series: *
Part Status: Active
Description

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The 242-125ABE-22 Thermal - Heat Sink is a type of heat dissipating device used primarily to keep heat generated by electronic components from damaging those components, and to maintain their optimal working temperature. Typically, these components include, but are not limited to, CPUs, motherboards, video cards, power supplies, and other items.

A Thermal - Heat Sink is typically a metal part that has fins or spikes to help surface area for cooling and thus dissipate heat away from vital components more efficiently. In other words, the 242-125ABE-22 unit helps to minimize the temperature of important electronic devices and stays within the limits of the operational temperature.

242-125ABE-22 thermal - heat sinks are mostly used on computer-driven devices and in other small devices that require efficient cooling solutions. The unit is typically made of aluminum, copper, and/or steel and uses forced convection to dissipate heat through the fins. The air flow, which causes the air surrounding the heat sink to circulate and cool down, is generally created by cooling fans.

The specific application of 242-125ABE-22 thermal - heat sink depends on the type of the components that are to be cooled. For example, if the 242-125ABE is used to cool a computer\'s processor, a special type of thermal paste must be applied first to fill air spaces between the unit and the component. This paste increases the contact between the two surfaces and helps to more efficiently dissipate heat.

In addition to its use in cooling processors, the 242-125ABE-22 thermal - heat sinks can also be used in other applications such as cooling memories, I/O chips, VRMs, and even ICs and power regulators. It is important to note that the unit needs to be sized relative to the other components in order to have the most efficient airflow.

The working principle behind the 242-125ABE-22 Thermal - Heat Sink is based on the convective heat transfer. This means that the heat is passively transferred from the heat sink to the atmosphere through the fins. The cooling fan then helps to create air flow to ensure the heat dissipates away from the heat sink.

To further reduce the temperature of components the 242-125ABE-22 thermal - heat sink can also use water or liquid coolers to directly cool down the components. Liquid coolers are basically pipes filled with a cooling liquid that help in transferring the heat away from the components. The usage of liquid coolers can help to reduce the overall temperature of the components even further than air cooling alone.

The 242-125ABE-22 Thermal - Heat Sinks can be a highly efficient way to keep vital components working properly. By utilizing the heat transfer process described earlier in combination with a cooling fan, the heat is taken away from the components and kept within the allowable limits of operation. In addition, the use of Liquid Coolers can further reduce the temperature. With all of these features the 242-125ABE-22 Thermal - Heat Sinks are an invaluable tool for ensuring that vital components remain at their optimal working temperature.

The specific data is subject to PDF, and the above content is for reference

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